MT41J256M8JE-187E ES:A Micron Technology Inc, MT41J256M8JE-187E ES:A Datasheet - Page 28

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MT41J256M8JE-187E ES:A

Manufacturer Part Number
MT41J256M8JE-187E ES:A
Description
Manufacturer
Micron Technology Inc
Type
DDR3 SDRAMr
Datasheet

Specifications of MT41J256M8JE-187E ES:A

Organization
256Mx8
Address Bus
15b
Maximum Clock Rate
1.066GHz
Operating Supply Voltage (typ)
1.5V
Package Type
FBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Supply Current
295mA
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
Thermal Characteristics
Table 8:
Figure 12: Thermal Measurement Point
PDF: 09005aef826aaadc/Source: 09005aef82a357c3
DDR3_D2.fm - Rev G 2/09 EN
Thermal Characteristics
Notes:
1. MAX operating case temperature. T
2. A thermal solution must be designed to ensure the DRAM device does not exceed the maxi-
3. Device functionality is not guaranteed if the DRAM device exceeds the maximum T
4. If T
5. The thermal resistance data is based off of a number of samples from multiple lots and
Parameter/Condition
Operating case temperature
Junction-to-case (TOP)
L
Figure 12).
mum T
operation.
interval refresh rate. The use of SRT or ASR (if available) must be enabled.
should be viewed as a typical number.
C
(L/2)
exceeds 85°C, the DRAM must be refreshed externally at 2X refresh, which is a 3.9µs
C
during operation.
W
28
78-ball “HX”
82-ball “JE”
96-ball “HA”
(W/2)
C
is measured in the center of the package (see
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T c test point
0 to 85
0 to 95
2Gb: x4, x8, x16 DDR3 SDRAM
Value
TBD
TBD
1.6
Thermal Characteristics
Units
°C/W
°C
°C
©2006 Micron Technology, Inc. All rights reserved.
Symbol
ΘJC
T
T
C
C
1, 2, 3, 4
C
Notes
1, 2, 3
during
5

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