MT47H128M8HQ-25E:G Micron Technology Inc, MT47H128M8HQ-25E:G Datasheet - Page 22

MT47H128M8HQ-25E:G

Manufacturer Part Number
MT47H128M8HQ-25E:G
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H128M8HQ-25E:G

Organization
128Mx8
Density
1Gb
Address Bus
17b
Access Time (max)
400ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
160mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
FBGA Package Capacitance
Table 4: Input Capacitance
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Parameter
Input capacitance: CK, CK#
Delta input capacitance: CK, CK#
Input capacitance: Address balls, bank address balls, CS#, RAS#, CAS#, WE#, CKE, ODT
Delta input capacitance: Address balls, bank address balls, CS#, RAS#, CAS#, WE#, CKE,
ODT
Input/output capacitance: DQ, DQS, DM, NF
Delta input/output capacitance: DQ, DQS, DM, NF
Notes:
1. This parameter is sampled. V
2. The capacitance per ball group will not differ by more than this maximum amount for
3. ΔC are not pass/fail parameters; they are targets.
4. Reduce MAX limit by 0.25pF for -25, -25E, and -187E speed devices.
5. Reduce MAX limit by 0.5pF for -3, -3E, -25, -25E, and -187E speed devices.
MHz, T
with I/O balls, reflecting the fact that they are matched in loading.
any given device.
C
= 25°C, V
OUT(DC)
= V
22
DDQ
DD
= +1.8V ±0.1V, V
/2, V
OUT
Micron Technology, Inc. reserves the right to change products or specifications without notice.
(peak-to-peak) = 0.1V. DM input is grouped
1Gb: x4, x8, x16 DDR2 SDRAM
DDQ
= +1.8V ±0.1V, V
Symbol Min Max Units Notes
C
C
C
C
C
DCK
C
DIO
CK
IO
DI
I
© 2004 Micron Technology, Inc. All rights reserved.
1.0
1.0
2.5
REF
0.25
0.25
2.0
2.0
4.0
0.5
= V
Packaging
SS
pF
pF
pF
pF
pF
pF
, f = 100
2, 3
1, 4
2, 3
1, 5
2, 3
1

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