MT47H256M8HG-25:A Micron Technology Inc, MT47H256M8HG-25:A Datasheet - Page 23

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MT47H256M8HG-25:A

Manufacturer Part Number
MT47H256M8HG-25:A
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H256M8HG-25:A

Organization
256Mx8
Address Bus
18b
Access Time (max)
400ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
190mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT47H256M8HG-25:A
Manufacturer:
MICROCHIP
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MT47H256M8HG-25:A
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FBGA Package Capacitance
Table 4: Input Capacitance
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Parameter
Input capacitance: CK, CK#
Delta input capacitance: CK, CK#
Input capacitance: BA[2:0], A[14:0] (A[13:0] on
x16), CS#, RAS#, CAS#, WE#, CKE, ODT
Delta input capacitance: Address balls, bank
address balls, CS#, RAS#, CAS#, WE#, CKE, ODT
Input/output capacitance: DQ, DQS, DM, NF
Delta input/output capacitance: DQ, DQS, DM,
NF
Notes:
1. This parameter is sampled. V
2. The capacitance per ball group will not differ by more than this maximum amount for
3. ΔC are not pass/fail parameters; they are targets.
4. Reduce MAX limit by 0.25pF for -3/-3E speed devices.
MHz, T
with I/O balls, reflecting the fact that they are matched in loading.
any given device.
C
= 25°C, V
Symbol
OUT(DC)
C
C
C
C
C
DCK
C
DIO
CK
DI
IO
I
= V
23
DD
DDQ
= +1.8V ±0.1V, V
/2, V
Min
1.0
1.0
2.5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
OUT
(peak-to-peak) = 0.1V. DM input is grouped
2Gb: x4, x8, x16 DDR2 SDRAM
DDQ
Max
0.25
0.25
2.0
2.0
4.0
0.5
= +1.8V ±0.1V, V
© 2006 Micron Technology, Inc. All rights reserved.
Units
pF
pF
pF
pF
pF
pF
REF
= V
Packaging
SS
, f = 100
Notes
2, 3
2, 3
1, 4
2, 3
1
1

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