IP4035CX24/LF/P,13 NXP Semiconductors, IP4035CX24/LF/P,13 Datasheet - Page 8

• Manufacturer Part Number: IP4035CX24/LF/P,13
• Description: IC EMI FILTER ESD PROTECT 24CSP
• Manufacturer: NXP Semiconductors

Specifications of IP4035CX24/LF/P,13

• Capacitance: 50pF
• Package / Case: 24-CSP
• Resistance In Ohms: 1.00K
• Operating Voltage: - 0.5 V to 5.5 V
• Channels: 10 Channels
• Breakdown Voltage: 6 V to 15 V
• Termination Style: SMD/SMT
• Power Dissipation Pd: 420 mW
• Operating Temperature Range: - 45 C to + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Tolerance: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934061587135

NXP Semiconductors
9. Design and assembly recommendations
IP4035CX24_1
Product data sheet
9.1 PCB design guidelines
9.2 PCB assembly guidelines for Pb-free soldering
For optimum performance it is recommended to use a Non-Solder Mask PCB Design
(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias
connecting the ground pads to a buried ground-plane layer. This results in the lowest
possible ground inductance and provides the best high frequency and ESD performance.
For this case, refer to
Table 7.
Table 8.
Parameter
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
Parameter
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder / flux ratio
Solder reflow profile
Fig 8.
The device is capable of withstanding at least three reflows of this profile.
Pb-free solder reflow profile
Recommended PCB design parameters
Assembly recommendations
All information provided in this document is subject to legal disclaimers.
T
reflow(peak)
Rev. 01 — 12 February 2010
Table 7
10-channel integrated filter network with ESD input protection
( C)
250
230
217
T
for the recommended PCB design parameters.
pre-heat
t
1
Value or specification
200 μm
100 μm (0.004 inch)
370 μm
20 μm to 40 μm
AuNi
FR4
Value or specification
330 μm
100 μm (0.004 inch)
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
50 / 50
see
t
5
Figure 8
t
2
t
t
3
4
cooling rate
IP4035CX24
001aai943
t (s)
© NXP B.V. 2010. All rights reserved.
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