ML610Q422-NNNTBZ03A7 Rohm Semiconductor, ML610Q422-NNNTBZ03A7 Datasheet - Page 8

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ML610Q422-NNNTBZ03A7

Manufacturer Part Number
ML610Q422-NNNTBZ03A7
Description
MCU 8BIT 32K FLASH 22CH 120-TQFP
Manufacturer
Rohm Semiconductor
Series
-r

Specifications of ML610Q422-NNNTBZ03A7

Core Processor
nX-U8/100
Core Size
8-Bit
Speed
4.2MHz
Connectivity
I²C, SSP, UART/USART
Peripherals
LCD, Melody Driver, POR, PWM, WDT
Number Of I /o
14
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.1 V ~ 3.6 V
Data Converters
A/D 2x12b, 2x24b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 70°C
Package / Case
100-TFQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ML610Q422-NNNTBZ03A7
Manufacturer:
ROHM
Quantity:
1 001
Part Number:
ML610Q422-NNNTBZ03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
Note:
OKI SEMICONDUCTOR
P20/LED0
P21/LED1
P22/LED2
ML610Q421 Chip Pin Layout & Dimension
The assignment of the pads P30 to P35 are not in order.
P40/SDA
P41/SCL
SEG49
COM0
COM1
COM2
COM3
COM4
COM5
COM6
COM7
AVDD
AVSS
VREF
AIN0
AIN1
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
Vss
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
89
90
91
92
93
94
95
96
97
98
99
Figure 5 ML610Q421 Chip Layout & Dimension
Chip size:
PAD count:
Minimum PAD pitch:
PAD aperture:
Chip thickness:
Voltage of the rear side of chip:
2.98mm
2.98 mm × 3.02 mm
116 pins
80 μm
70 μm × 70 μm
350 μm
V
SS
level
ML610Q421/ML610Q422
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
VDD
P11
P10
Vss
P03
P02
P01
P00
C4
C3
FEDL610Q421-01
3.02mm
8/35

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