STM32L151VBT6 STMicroelectronics, STM32L151VBT6 Datasheet - Page 103

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STM32L151VBT6

Manufacturer Part Number
STM32L151VBT6
Description
MCU ARM 128KB FLASH 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32L151VBT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
32MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
83
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Data Converters
A/D 24x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LFQFP
Processor Series
STM32L151
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-11195

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STM32L151xx, STM32L152xx
7.2
7.2.1
Thermal characteristics
The maximum chip-junction temperature, T
using the following equation:
Where:
P
taking into account the actual V
application.
Table 63.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Symbol
I/O
JA
max represents the maximum power dissipation on output pins where:
T
P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in C/W,
max = (V
Thermal resistance junction-ambient
BGA100 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFQFPN48 - 7 x 7 mm / 0.5 mm pitch
max is the product of I
Thermal characteristics
OL
× I
OL
T
INT
) + ((V
J
Doc ID 17659 Rev 4
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
A
– V
and V
max + (P
DD
OH
I/O
J
, expressed in Watts. This is the maximum chip
max, in degrees Celsius, may be calculated
OH
) × I
max (P
/ I
OH
D
OH
),
max × 
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Package characteristics
max + P
Value
59
46
45
55
16
I/O
max),
103/107
°C/W
Unit

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