STM32L151VBT6 STMicroelectronics, STM32L151VBT6 Datasheet - Page 97

• Manufacturer Part Number: STM32L151VBT6
• Description: MCU ARM 128KB FLASH 100LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32L151VBT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 83
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 24x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LFQFP
• Processor Series: STM32L151
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 6
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-11195

STM32L151xx, STM32L152xx
Figure 33. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
1. Drawing is not to scale.
Table 58.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
Symbol
Seating
plane
TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
0.150
0.250
4.850
4.850
Min
C
A4
millimeters
A1
A3
A2
A
0.785
0.200
0.300
5.000
3.500
5.000
3.500
0.500
0.750
0.080
0.150
0.050
Doc ID 17659 Rev 4
Typ
B
H
G
F
E
D
C
B
A
A1 ball pad corner
e
1.200
0.600
0.350
5.150
5.150
Max
1
2
3
4
Bottom view
D
D1
5
0.0059
0.0098
0.1909
0.1909
Øb (64 balls)
Min
6
7
F
8
Package characteristics
inches
0.0309
0.0079
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
0.0031
0.0059
0.0020
F
e
Typ
E1
(1)
ME_R8
E
A
0.0472
0.0236
0.0138
0.2028
0.2028
Max
97/107