MC100ES6226AC IDT, Integrated Device Technology Inc, MC100ES6226AC Datasheet - Page 4

• Manufacturer Part Number: MC100ES6226AC
• Description: IC CLK DIVIDER FAN BUFF 32LQFP
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Fanout Buffer (Distribution), Dividerr
• Series: 100ESr

Specifications of MC100ES6226AC

• Number Of Circuits: 1
• Ratio - Input:output: 1:9
• Differential - Input:output: Yes/Yes
• Input: LVCMOS, LVPECL
• Output: LVPECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: 0°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Frequency-max: 3GHz
• Number Of Clock Inputs: 1
• Mode Of Operation: Differential
• Output Frequency: 3000MHz
• Output Logic Level: LVPECL
• Operating Supply Voltage (min): 2.375V
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465V
• Package Type: TQFP
• Operating Temp Range: 0C to 110C
• Operating Temperature Classification: Commercial
• Signal Type: LVPECL
• Mounting: Surface Mount
• Pin Count: 32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 800-2002; MC100ES6226ACIDT

Table 5. General Specifications
IDT™ / ICS™ CLOCK DISTRIBUTION BUFFER/CLOCK DRIVER
Symbol
1. Output termination voltage V
2. Operating junction temperature impacts device life time. Maximum continuous operating junction temperature should be selected according
MC100ES6226
2.5V/3.3V DIFFERENTIAL LVPECL 1:9 CLOCK DISTRIBUTION BUFFER AND CLOCK DRIVER
HBM
CDM
V
MM
C
θ
θ
LU
to the application life time requirements (See application note AN1545 for more information). The device AC and DC parameters are
specified up to 110°C junction temperature allowing the MC100ES6226 to be used in applications requiring industrial temperature range. It
is recommended that users of the MC100ES6226 employ thermal modeling analysis to assist in applying the junction temperature
specifications to their particular application.
JC
TT
JA
IN
Output Termination Voltage
ESD Protection (Machine Model)
ESD Protection (Human Body Model)
ESD Protection (Charged Device Model)
Latch-Up Immunity
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Operating Junction Temperature
(continuous operation)
JESD 51-6, 2S2P multilayer test board
JESD 51-3, single layer test board
Characteristics
TT
= 0 V for V
MTBF = 9.1 years
(2)
CC
= 2.5 V operation is supported but the power consumption of the device will increase.
4000
2000
Min
300
200
0
4
V
CC
83.1
73.3
68.9
63.8
57.4
59.0
54.4
52.5
50.4
47.8
23.0
Typ
4.0
– 2
(1)
Max
86.0
75.4
70.9
65.3
59.6
60.6
55.7
53.8
51.5
48.8
26.3
110
MC100ES6226 REV. 5 NOVEMBER 10, 2008
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
mA
pF
°C
V
V
V
V
Inputs
Natural convection
100 ft/min
200 ft/min
400 ft/min
800 ft/min
Natural convection
100 ft/min
200 ft/min
400 ft/min
800 ft/min
MIL-SPEC 883E
Method 1012.1
Condition