PCK9446BD,151 NXP Semiconductors, PCK9446BD,151 Datasheet - Page 15

• Manufacturer Part Number: PCK9446BD,151
• Description: IC FANOUT BUFFER LVCMOS 32LQFP
• Manufacturer: NXP Semiconductors
• Type: Fanout Buffer (Distribution), Divider, Multiplexerr

Specifications of PCK9446BD,151

• Number Of Circuits: 1
• Ratio - Input:output: 2:10
• Differential - Input:output: No/No
• Input: LVCMOS
• Output: LVCMOS
• Frequency - Max: 250MHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Frequency-max: 250MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3643-5; 935280839151; PCK9446BD-S

Philips Semiconductors
15. Abbreviations
16. Revision history
Table 14.
PCK9446_1
Product data sheet
Document ID
PCK9446_1
(9397 750 12485)
Revision history
[4]
[5]
[6]
[7]
[8]
[9]
Table 13.
Acronym
LVCMOS
LVPECL
Release date
20060410
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Description
Low Voltage Complementary Metal Oxide Silicon
Low Voltage Positive Emitter Coupled Logic
Data sheet status
Product data sheet
Rev. 01 — 10 April 2006
2.5 V and 3.3 V LVCMOS clock fan-out buffer
Change notice
-
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Supersedes
-
PCK9446
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