PCK9456BD,151 NXP Semiconductors, PCK9456BD,151 Datasheet
PCK9456BD,151
Specifications of PCK9456BD,151
935280285151
PCK9456BD-S
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PCK9456BD,151 Summary of contents
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PCK9456 2.5 V and 3.3 V LVCMOS clock fan-out buffer Rev. 01 — 31 July 2006 1. General description The PCK9456 is a 2.5 V and 3.3 V compatible clock distribution buffer designed for low voltage mid-range ...
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Philips Semiconductors 4. Functional diagram Fig 1. Functional diagram of PCK9456 PCK9456_1 Product data sheet PCK9456 PCLK 25 k PCLK 25 k 0.5V CC FSELA 25 k FSELB 25 k FSELC 25 k MR/ Rev. 01 — 31 ...
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Philips Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Pin configuration for LQFP32 5.2 Pin description Table 2. Symbol PECL_CLK PECL_CLK FSELA FSELB FSELC GND VCCA VCCB VCCC V CC QA0, QA1, QA2 QB0, QB1, QB2 QC0, QC1, QC2, QC3 ...
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Philips Semiconductors 6. Functional description The PCK9456 is a full static design supporting clock frequencies up to 250 MHz. The signals are generated and re-timed on-chip to ensure minimal skew between the three output banks (see Each of the three ...
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Philips Semiconductors 7. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol stg 8. Recommended operating conditions Table 6. Symbol ...
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Philips Semiconductors Table 8. Static characteristics (3 + amb CC Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL V peak-to-peak input voltage i(p-p) V common mode ...
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Philips Semiconductors Table 10. Dynamic characteristics (3 + amb CC Symbol Parameter f input frequency i f maximum output frequency o(max) V peak-to-peak input voltage i(p-p) [3] V common mode ...
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Philips Semiconductors Table 11. Dynamic characteristics (2 + amb CC Symbol Parameter f input frequency i f maximum output frequency o(max) V peak-to-peak input voltage i(p-p) [3] V common mode ...
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Philips Semiconductors Table 12. Dynamic characteristics + 3.3 V amb CC Symbol Parameter t output skew time sk(o) t process skew time sk(pr) t pulse skew time sk(p) t LOW-to-HIGH propagation delay ...
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Philips Semiconductors 10. Application information 10.1 Driving transmission lines The PCK9456 clock driver was designed to drive high speed signals in a terminated transmission line environment. To provide the optimum flexibility to the user, the output drivers were designed to ...
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Philips Semiconductors The waveform plots of versus two lines. In both cases the drive capability of the PCK9456 output buffer is more than sufficient to drive 50 measurement in the simulations a delta of only 43 ps exists between the ...
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Philips Semiconductors Fig 9. Optimized dual line termination 11. Test information Fig 10. PCLK PCK9456 AC test reference for V PCK9456_1 Product data sheet PCK9456 OUTPUT BUFFER ...
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Philips Semiconductors 12. Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) ...
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Philips Semiconductors 13. Soldering 13.1 Introduction to soldering surface mount packages There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not ...
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Philips Semiconductors – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to ...
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Philips Semiconductors [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C body ...
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Philips Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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Philips Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...