LMK02000ISQ/NOPB National Semiconductor, LMK02000ISQ/NOPB Datasheet - Page 4

• Manufacturer Part Number: LMK02000ISQ/NOPB
• Description: IC CLOCK CONDITIONER PREC 48-LLP
• Manufacturer: National Semiconductor
• Type: Clock Conditionerr

Specifications of LMK02000ISQ/NOPB

• Pll: Yes
• Input: Clock
• Output: LVDS, LVPECL
• Number Of Circuits: 1
• Ratio - Input:output: 2:8
• Differential - Input:output: Yes/Yes
• Frequency - Max: 800MHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 3.15 V ~ 3.45 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-LLP
• Frequency-max: 800MHz
• For Use With: LMK02000EVAL-1 - BOARD EVAL WITH 245.76 VCXOLMK02000EVAL2 - BOARD EVALUATION FOR LMK02000
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LMK02000ISQ; LMK02000ISQTR

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I
I
f
V
f
SLEW
DUTY
P
CC
CC
OSCin
Fin
OSCin
Fin
Absolute Maximum Ratings
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors
for availability and specifications.
Recommended Operating Conditions
Note 1: "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be operated beyond such conditions.
Note 2: This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD protected work
stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.
Package Thermal Resistance
Note 3: Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These vias play a key
role in improving the thermal performance of the LLP. It is recommended that the maximum number of vias be used in the board layout.
Electrical Characteristics
(3.15 V
parametric norms at Vcc = 3.3 V, T
and are not guaranteed).
Symbol
Power Supply Voltage
Input Voltage
Storage Temperature Range
Lead Temperature (solder 4 s)
Junction Temperature
Ambient Temperature
Power Supply Voltage
PD
square
Fin
square
Fin
≤
Vcc
Power Supply Current
(Note 5)
Power Down Current
Reference Oscillator Input Frequency
Range for Square Wave
Square Wave Input Voltage for OSCin and
OSCin*
Frequency Input Frequency Range
Frequency Input Slew Rate
Frequency Input Duty Cycle
Input Power Range for Fin or Fin*
Parameter
≤
3.45 V, -40 °C
Parameter
Parameter
48-Lead LLP (Note 3)
≤
T
A
A
= 25 °C, and at the Recommended Operation Conditions at the time of product characterization
Package
≤
85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most likely
(Note 4)
Symbol
V
T
(Notes 1, 2)
CC
A
Current Consumption
Reference Oscillator
Symbol
Frequency Input
Entire device; CLKout0 & CLKout4
enabled in Bypass Mode
Entire device; All Outputs Off (no
emitter resistors placed)
POWERDOWN = 1
AC coupled; Differential (V
(Notes 6, 10)
AC coupled
T
V
V
T
T
STG
CC
IN
L
J
27.4° C/W
θ
4
JA
3.15
Min
-40
Conditions
θ
J-PAD (Thermal Pad)
-0.3 to (V
OD
5.8° C/W
Typ
3.3
25
-0.3 to 3.6
-65 to 150
)
Ratings
+260
125
CC
+ 0.3)
Min
-13
0.2
0.5
40
1
1
Max
3.45
85
145.8
Typ
70
1
Units
Max
200
800
1.6
°C
°C
°C
60
V
V
8
Units
°C
V
Units
MHz
MHz
dBm
V/ns
Vpp
mA
mA
%