1-120524-1 TE Connectivity, 1-120524-1 Datasheet - Page 2

• Manufacturer Part Number: 1-120524-1
• Description: 1FHR,64,50A/P,S,N,S14,15
• Manufacturer: TE Connectivity

Specifications of 1-120524-1

• Rohs Compliant: NO
• Pcb Mount Retention: With
• Pcb Mount Alignment: With
• Product Type: Connector
• Connector Type: Connector Assembly
• Product Line: 1mm FH
• Ul File Number: E28476
• Csa File Number: LR7189
• Termination Method To Pc Board: Surface Mount
• Pcb Mounting Orientation: Vertical
• Pcb Mount Alignment Type: Locating Posts
• Contact - Rated Current (a): 0.8
• Operating Voltage Reference: AC/DC
• Operating Voltage (vac): 250
• Operating Voltage (vdc): 250
• Tail Length (mm [in]): 2.05 [0.081]
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 10.37 [0.408]
• Number Of Positions: 64
• Number Of Columns: 32
• Centerline (mm [in]): 1.00 [0.039]
• Underplate Material Thickness (µm [?in]): 1.27 [50.000]
• Length (x-axis) (mm [in]): 34.22 [1.347]
• Width (z-axis) (mm [in]): 6.04 [0.238]
• Number Of Rows: 2
• Pcb Mount Retention Type: Locating Posts
• Mating Retention: Without
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 1.27 [50]
• Tail Plating Material: Tin-Lead
• Tail Plating, Thickness (µm [?in]): 3.81 [150]
• Underplate Material: Nickel
• Contact Design: Single Beam
• Pitch (mm [in]): 16.00 [0.630]
• Tin To Lead Ratio: 93 / 7
• Connector Style: Receptacle
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Mating Alignment: Without
• Housing Material: Thermoplastic
• Stack Height (mm [in]): 14.00 [0.551], 15.00 [0.591]
• Differential Signaling: With
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Industry Standard: IEEE 1386 Mezzanine Connector
• Agency/standard: UL, CSA
• Ul Rating: Listed
• Csa Certified: Yes
• Operating Temperature (°c [°f]): -55 – +110 [-67 – +230]
• Applies To: Printed Circuit Board
• Board-to-board Configuration: Mezzanine
• Pick And Place Cover: Without
• Application Use: Board-to-Board
• Contact Transmits (typical Application): Signal (Data)
• Packaging Method: Tape & Reel

3.2.
3.3.
3.4.
3.5.
Initial exam ination of product.
Final exam ination of product.
Low Level Contact Resistance
(LLCR).
Insulation resistance.
W ithstanding voltage.
Solderability.
Random vibration.
Rev E
Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
Ratings
!
!
!
Perform ance and Test Description
Product is designed to m eet the electrical, m echanical and environm ental perform ance requirem ents
specified in Figure 1. Unless otherwise specified, all tests shall be perform ed at am bient environm ental
conditions.
Test Requirem ents and Procedures Sum m ary
Test Description
Voltage: 250 volts AC
Current: 0.8 am pere m axim um per circuit
Tem perature: -55 to 110°C
Meets visual requirem ents.
Meets requirem ents of product
drawing and Application
Specification 114-25045.
24 m illiohm s m axim um initial for 8
m m stack height.
45 m illiohm s m axim um initial for 15
m m stack height.
ÄR 15 m illiohm s m axim um increase
from initial.
1000 m egohm s m inim um .
One m inute hold with no breakdown
or flashover.
Solderable area shall have a
m inim um of 95% solder coverage.
No discontinuities of 1 m icrosecond
or longer duration.
See Note.
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirem ent
EIA-364-18.
EIA-364-21.
EIA-364-18.
Visual and dim ensional (C of C)
inspection per product drawing.
Visual inspection.
EIA-364-23.
Subject specim ens to 100
m illiam peres m axim um and 20
m illivolts m axim um open circuit
voltage.
250 volts DC,1 m inute hold.
Test between adjacent contacts of
m ated specim ens.
EIA-364-20.
250 volts AC at sea level.
Test between adjacent contacts of
m ated specim ens.
EIA-364-52, Category 3.
Subject contacts to solderability.
EIA-364-28.
Subject m ated specim ens to 9.26
G’s rm s between 50 to 2000 Hz.
Fifteen m inutes in each of 3
m utually perpendicular planes.
Procedure
108-2246
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