1-120524-1 TE Connectivity, 1-120524-1 Datasheet - Page 4

• Manufacturer Part Number: 1-120524-1
• Description: 1FHR,64,50A/P,S,N,S14,15
• Manufacturer: TE Connectivity

Specifications of 1-120524-1

• Rohs Compliant: NO
• Pcb Mount Retention: With
• Pcb Mount Alignment: With
• Product Type: Connector
• Connector Type: Connector Assembly
• Product Line: 1mm FH
• Ul File Number: E28476
• Csa File Number: LR7189
• Termination Method To Pc Board: Surface Mount
• Pcb Mounting Orientation: Vertical
• Pcb Mount Alignment Type: Locating Posts
• Contact - Rated Current (a): 0.8
• Operating Voltage Reference: AC/DC
• Operating Voltage (vac): 250
• Operating Voltage (vdc): 250
• Tail Length (mm [in]): 2.05 [0.081]
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 10.37 [0.408]
• Number Of Positions: 64
• Number Of Columns: 32
• Centerline (mm [in]): 1.00 [0.039]
• Underplate Material Thickness (µm [?in]): 1.27 [50.000]
• Length (x-axis) (mm [in]): 34.22 [1.347]
• Width (z-axis) (mm [in]): 6.04 [0.238]
• Number Of Rows: 2
• Pcb Mount Retention Type: Locating Posts
• Mating Retention: Without
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 1.27 [50]
• Tail Plating Material: Tin-Lead
• Tail Plating, Thickness (µm [?in]): 3.81 [150]
• Underplate Material: Nickel
• Contact Design: Single Beam
• Pitch (mm [in]): 16.00 [0.630]
• Tin To Lead Ratio: 93 / 7
• Connector Style: Receptacle
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Mating Alignment: Without
• Housing Material: Thermoplastic
• Stack Height (mm [in]): 14.00 [0.551], 15.00 [0.591]
• Differential Signaling: With
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Industry Standard: IEEE 1386 Mezzanine Connector
• Agency/standard: UL, CSA
• Ul Rating: Listed
• Csa Certified: Yes
• Operating Temperature (°c [°f]): -55 – +110 [-67 – +230]
• Applies To: Printed Circuit Board
• Board-to-board Configuration: Mezzanine
• Pick And Place Cover: Without
• Application Use: Board-to-Board
• Contact Transmits (typical Application): Signal (Data)
• Packaging Method: Tape & Reel

3.6.
Rev E
Product Qualification and Requalification Test Sequence
NOTE
(a)
(b)
Initial exam ination of product
LLCR
Insulation resistance
W ithstanding voltage
Solderability
Random vibration
Mechanical shock
Durability
Mating force
Unm ating force
Therm al shock
Hum idity/tem perature cycling
Tem perature life
Mixed flowing gas
Final exam ination of product
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Tests Perform ed
2,5
Figure 2
1
1
4
3
6
2,10
3,7
4,8
5,9
11
2
1
6
Test Sequence (b)
Test Groups (a)
2,5
3
1
3
4
6
2,6
3,7
4
1
4
5
8
2,4
5
1
3
5
6
1
2
3
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