1-120524-1 TE Connectivity, 1-120524-1 Datasheet - Page 5

• Manufacturer Part Number: 1-120524-1
• Description: 1FHR,64,50A/P,S,N,S14,15
• Manufacturer: TE Connectivity

Specifications of 1-120524-1

• Rohs Compliant: NO
• Pcb Mount Retention: With
• Pcb Mount Alignment: With
• Product Type: Connector
• Connector Type: Connector Assembly
• Product Line: 1mm FH
• Ul File Number: E28476
• Csa File Number: LR7189
• Termination Method To Pc Board: Surface Mount
• Pcb Mounting Orientation: Vertical
• Pcb Mount Alignment Type: Locating Posts
• Contact - Rated Current (a): 0.8
• Operating Voltage Reference: AC/DC
• Operating Voltage (vac): 250
• Operating Voltage (vdc): 250
• Tail Length (mm [in]): 2.05 [0.081]
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 10.37 [0.408]
• Number Of Positions: 64
• Number Of Columns: 32
• Centerline (mm [in]): 1.00 [0.039]
• Underplate Material Thickness (µm [?in]): 1.27 [50.000]
• Length (x-axis) (mm [in]): 34.22 [1.347]
• Width (z-axis) (mm [in]): 6.04 [0.238]
• Number Of Rows: 2
• Pcb Mount Retention Type: Locating Posts
• Mating Retention: Without
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 1.27 [50]
• Tail Plating Material: Tin-Lead
• Tail Plating, Thickness (µm [?in]): 3.81 [150]
• Underplate Material: Nickel
• Contact Design: Single Beam
• Pitch (mm [in]): 16.00 [0.630]
• Tin To Lead Ratio: 93 / 7
• Connector Style: Receptacle
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Mating Alignment: Without
• Housing Material: Thermoplastic
• Stack Height (mm [in]): 14.00 [0.551], 15.00 [0.591]
• Differential Signaling: With
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Industry Standard: IEEE 1386 Mezzanine Connector
• Agency/standard: UL, CSA
• Ul Rating: Listed
• Csa Certified: Yes
• Operating Temperature (°c [°f]): -55 – +110 [-67 – +230]
• Applies To: Printed Circuit Board
• Board-to-board Configuration: Mezzanine
• Pick And Place Cover: Without
• Application Use: Board-to-Board
• Contact Transmits (typical Application): Signal (Data)
• Packaging Method: Tape & Reel

4.
4.1.
4.2.
4.3.
4.4.
Rev E
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form , fit or function are m ade to the product or m anufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determ ined by developm ent/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product m eets the requirem ents of Figure 1. Failures
attributed to equipm ent, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specim ens resubm itted for qualification. Testing to
confirm corrective action is required before resubm ittal.
Quality Conform ance Inspection
The applicable quality inspection plan shall specify the sam pling acceptable quality level to be used.
Dim ensional and functional requirem ents shall be in accordance with the applicable product drawing
and this specification.
Specim en Selection
Specim ens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Each test group shall consist of 2 row, 64 position, 1.0
m m Mezzanine plug and receptacle connectors fully loaded with 30 m icroinch gold plated contacts.
Two connector sizes having parallel board to board m ated stack heights of 8 and 15 m m were
tested in each group.
Test Sequence
Qualification inspection shall be verified by testing specim ens as specified in Figure 2.
108-2246
5 of 5