MAX19710ETN+T Maxim Integrated Products, MAX19710ETN+T Datasheet - Page 2

IC ANLG FRNT END 56-TQFN

MAX19710ETN+T

Manufacturer Part Number
MAX19710ETN+T
Description
IC ANLG FRNT END 56-TQFN
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX19710ETN+T

Number Of Bits
10
Number Of Channels
2
Power (watts)
30mW
Voltage - Supply, Analog
3V
Voltage - Supply, Digital
3V
Package / Case
56-TQFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
V DD to GND, OV DD to OGND ..............................-0.3V to +3.6V
GND to OGND.......................................................-0.3V to +0.3V
IAP, IAN, QAP, QAN, IDP, IDN, QDP,
ADC1, ADC2 to GND.................................-0.3V to (V DD + 0.3V)
REFP, REFN, REFIN, COM to GND ...........-0.3V to (V DD + 0.3V)
AD0–AD9, DA0–DA9, SCLK, DIN, CS/WAKE,
10-Bit, 7.5Msps, Full-Duplex
Analog Front-End
ELECTRICAL CHARACTERISTICS
(V
amplitude = -0.5dBFS, Tx DAC output amplitude = 0dBFS, CM1 = 0, CM0 = 0, differential Rx ADC input, differential Tx DAC output,
C
T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
A
POWER REQUIREMENTS
Analog Supply Voltage
Output Supply Voltage
V
REFP
DD
QDN, DAC1, DAC2, DAC3 to GND .....................-0.3V to V DD
CLK, DOUT to OGND .........................-0.3V to (OV DD + 0.3V)
DD
= +25°C.) (Note 1)
_______________________________________________________________________________________
= 3V, OV
Supply Current
= C
REFN
PARAMETER
DD
= C
= 1.8V, internal reference (1.024V), C
COM
= 0.33µF, C
L
< 5pF on all aux-DAC outputs, T
SYMBOL
OV
V
DD
DD
FD mode: f
on both DAC channels;
f
aux-DACs ON and at midscale, aux-ADC
ON
SPI2-Tx mode: f
620kHz on both DAC channels; Rx ADC
OFF; aux-DACs ON and at midscale, aux-
ADC ON
SPI1-Rx mode: f
1.875MHz on both ADC channels; Tx DAC
OFF (Tx DAC outputs at 0V); aux-DACs
ON and at midscale, aux-ADC ON
SPI4-Tx mode: f
620kHz on both DAC channels; Rx ADC
ON (output tri-stated); aux-DACs ON and
at midscale, aux-ADC ON
IN
= 1.875MHz on both ADC channels;
L
≈ 10pF on all digital outputs, f
CLK
CONDITIONS
= 7.5MHz, f
CLK
CLK
CLK
Continuous Power Dissipation (T A = +70°C)
Thermal Resistance θ JA ..................................................36°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
A
56-Pin Thin QFN-EP (derate 27.8mW/°C above +70°C) 2.22W
= 7.5MHz, f
= 7.5MHz, f
= 7.5MHz, f
= T
MIN
OUT
to T
= 620kHz
OUT
OUT
MAX
IN
=
CLK
, unless otherwise noted. Typical values are at
=
=
= 7.5MHz (50% duty cycle), Rx ADC input
MIN
2.7
1.8
TYP
3.0
7.3
7.1
9.7
10
MAX
V
3.3
12
12
DD
9
9
UNITS
mA
V
V

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