HI5714/7CBZ-T Intersil, HI5714/7CBZ-T Datasheet - Page 13

CONV A/D 8BIT PREC 24-SOIC

HI5714/7CBZ-T

Manufacturer Part Number
HI5714/7CBZ-T
Description
CONV A/D 8BIT PREC 24-SOIC
Manufacturer
Intersil
Datasheet

Specifications of HI5714/7CBZ-T

Number Of Bits
8
Sampling Rate (per Second)
75M
Data Interface
Parallel
Number Of Converters
1
Power Dissipation (max)
375mW
Voltage Supply Source
Analog and Digital
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
24-SOIC (0.300", 7.50mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
HI5714/7CBZ-TTR
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
SUBSTRATE POTENTIAL (POWERED UP):
Metallization Mask Layout
134 mils x 134 mils x 19 mils ±1 mil
Type: AlSiCu
Thickness: M1 - 8k
GND (0.0V)
AGND
V
V
CCA
V
V
RB
RT
IN
Å
, M2 - 17k
13
O/UF
DO
Å
D7
D1
D6
HI5714
D2
HI5714
PASSIVATION:
WORST CASE CURRENT DENSITY:
TRANSISTOR COUNT:
DIE ATTACH:
D5
D3
Type: Sandwich Passivation* Undoped Silicon Glass
Thickness: USG - 8k
Total 12.2k
1.6 x 10
3714
Silver Filled Epoxy
D4
4
(USG) + Nitride
A/cm
Å
+ 2k
2
OE
Å
Å
, Nitride - 4.2k
V
OGND
V
V
DGND
CLK
CC02
CC01
CCD
Å

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