X95820WV14IZ-2.7T1 Intersil, X95820WV14IZ-2.7T1 Datasheet - Page 12

• Manufacturer Part Number: X95820WV14IZ-2.7T1
• Description: IC POT DGTL DUAL 10K OHM 14TSSOP
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of X95820WV14IZ-2.7T1

• Taps: 256
• Resistance (ohms): 10K
• Number Of Circuits: 2
• Temperature Coefficient: 45 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP
• Resistance In Ohms: 10K
• Number Of Elements: 2
• # Of Taps: 256
• Resistance (max): 10KOhm
• Power Supply Requirement: Single
• Interface Type: Serial (I2C)
• Single Supply Voltage (typ): 3.3V
• Dual Supply Voltage (typ): Not RequiredV
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 14
• Package Type: TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: X95820WV14IZ-2.7T1TR

Thin Shrink Small Outline Plastic Packages (TSSOP)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
0.10(0.004)
JEDEC MO-153-AC, Issue E.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
feature must be located within the crosshatched area.
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
are not necessarily exact. (Angles in degrees)
2
-A-
INDEX
AREA
3
e
0.05(0.002)
b
D
M
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
C A
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
SEATING PLANE
M
E1
For information regarding Intersil Corporation and its products, see www.intersil.com
-C-
-B-
B S
A
12
E
A1
α
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
0.010
A2
M
0.25
B
M
L
c
X95820
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
A1
A2
E1
A
D
E
N
α
b
c
e
L
0.002
0.031
0.0075
0.0035
0.195
0.169
0.246
0.0177
MIN
0
-
0.026 BSC
o
INCHES
14
0.047
0.006
0.041
0.0118
0.0079
0.199
0.177
0.256
0.0295
MAX
8
o
MILLIMETERS
0.05
0.80
0.19
0.09
4.95
4.30
6.25
0.45
MIN
0
-
o
0.65 BSC
14
MAX
1.20
0.15
1.05
0.30
0.20
5.05
4.50
6.50
0.75
8
o
Rev. 2 4/06
July 18, 2006
NOTES
FN8212.2
9
3
4
6
7
-
-
-
-
-
-
-