AD7305BR Analog Devices Inc, AD7305BR Datasheet - Page 18

• Manufacturer Part Number: AD7305BR
• Description: IC DAC 8BIT QUAD 5V R-R 20-SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD7305BR

• Mounting Type: Surface Mount
• Rohs Status: RoHS non-compliant
• Settling Time: 1µs
• Number Of Bits: 8
• Data Interface: Parallel
• Number Of Converters: 4
• Voltage Supply Source: Dual ±
• Power Dissipation (max): 60mW
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SOIC (7.5mm Width)
• Resolution (bits): 8bit
• No. Of Pins: 20
• Peak Reflow Compatible (260 C): No
• Update Rate: 1MSPS
• No. Of Bits: 8 Bit
• Leaded Process Compatible: No
• Interface Type: Parallel
• Converter Type: Digital to Analog
• Current, Output: ±3 mA (Typ.)
• Input Capacitance: 8 pF (Max.)
• Number Of Converter: 4
• Number Of Pins: 20
• Package Type: SOIC
• Power Dissipation: 15 mW (Max.)
• Resolution: 8 Bits
• Slew Rate: 1⁄2.7 V⁄uS
• Temperature, Operating, Maximum: 85 °C
• Temperature, Operating, Minimum: -40 °C
• Thermal Resistance, Junction To Ambient: 74 °C⁄W
• Voltage, Input, High Level: 2.1 V (Max.)
• Voltage, Input, Low Level: 0.6 V (Min.)
• Voltage, Range: 2.7 to 5.5 V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

AD7304/AD7305
OUTLINE DIMENSIONS
0.30 (0.0118)
0.10 (0.0039)
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
COPLANARITY
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.10
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 39. 16-Lead Standard Small Outline Package [SOIC]
Figure 40. 20-Lead Standard Small Outline Package [SOIC]
20
1
16
1
Dimensions shown in millimeters and (inches)
Dimensions shown in millimeters and (inches)
1.27 (0.0500)
COMPLIANT TO JEDEC STANDARDS MS-013AC
(0.0500)
COMPLIANT TO JEDEC STANDARDS MS-013AA
10.50 (0.4134)
10.10 (0.3976)
1.27
BSC
BSC
0.51 (0.0201)
0.31 (0.0122)
13.00 (0.5118)
12.60 (0.4961)
0.51 (0.0201)
0.31 (0.0122)
Wide Body (R-16)
Wide Body (R-20)
9
8
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
11
10
7.60 (0.2992)
7.40 (0.2913)
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
10.65 (0.4193)
10.00 (0.3937)
0.33 (0.0130)
0.20 (0.0079)
0.33 (0.0130)
0.20 (0.0079)
8°
0°
8°
0°
0.75 (0.0295)
0.25 (0.0098)
0.75 (0.0295)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
1.27 (0.0500)
0.40 (0.0157)
× 45°
× 45°
Rev. C | Page 18 of 20
COPLANARITY
0.15
0.05
0.15
0.05
4.50
4.40
4.30
PIN 1
PIN 1
Figure 41. 16-Lead Thin Shrink Small Outline Package [TSSOP]
Figure 42. 20-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
0.10
16
1
20
COPLANARITY
1
BSC
0.65
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153AB
5.10
5.00
4.90
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AC
6.60
6.50
6.40
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
1.20 MAX
9
8
1.20
MAX
SEATING
PLANE
BSC
6.40
11
10
SEATING
PLANE
(RU-16)
(RU-20)
0.20
0.09
4.50
4.40
4.30
0.20
0.09
6.40 BSC
8°
0°
8°
0°
0.75
0.60
0.45
0.75
0.60
0.45