MT36JSZF1G72PDZ-1G1D1 Micron Technology Inc, MT36JSZF1G72PDZ-1G1D1 Datasheet

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MT36JSZF1G72PDZ-1G1D1

Manufacturer Part Number
MT36JSZF1G72PDZ-1G1D1
Description
MODULE DDR3 SDRAM 8GB 240RDIMM
Manufacturer
Micron Technology Inc
Series
-r

Specifications of MT36JSZF1G72PDZ-1G1D1

Memory Type
DDR3 SDRAM
Memory Size
8GB
Speed
1066MT/s
Features
-
Package / Case
240-RDIMM
Lead Free Status / Rohs Status
Supplier Unconfirmed
DDR3 SDRAM RDIMM
MT36JSZF51272PDZ – 4GB
MT36JSZF1G72PDZ – 8GB
Features
• DDR3 functionality and operations supported as
• 240-pin, registered dual in-line memory module
• Fast data transfer rates: PC3-12800, PC3-10600,
• 4GB (512 Meg x 72), 8GB (1 Gig x 72)
• V
• V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
• Quad rank
• On-board I
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
• Full module heat spreader
Table 1: Key Timing Parameters
PDF: 09005aef83950b83
JSZF36C512_1Gx72PDZ.pdf – Rev. A 8/09 EN
Speed
Grade
defined in the component data sheet
(RDIMM)
PC3-8500, or PC3-6400
data, strobe, and mask signals
serial presence-detect (SPD) EEPROM
via the mode register set (MRS)
-1G6
-1G4
-1G1
-1G0
-80C
-80B
DD
DDSPD
= 1.5V ±0.075V
= +3.0V to +3.6V
Nomenclature
PC3-12800
PC3-10600
2
Industry
PC3-8500
PC3-8500
PC3-6400
PC3-6400
C temperature sensor with integrated
Products and specifications discussed herein are subject to change by Micron without notice.
CL = 11 CL = 10
1600
4GB, 8GB (x72, ECC, QR) 240-Pin Halogen-Free DDR3 RDIMM
1333
1333
CL = 9
1333
1333
Data Rate (MT/s)
CL = 8
1066
1066
1066
1066
1
Figure 1: 240-Pin RDIMM (MO-269 R/C H)
Module height: 30.0mm (1.181in)
Options
• Operating temperature
• Package
• Frequency/CAS latency
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 240-pin DIMM (halogen-free)
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3 1066)
Note:
CL = 7
1066
1066
1066
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1. Contact Micron for industrial temperature
CL = 6
module offerings.
800
800
800
800
800
800
CL = 5
667
667
667
667
800
667
1
A
A
≤ +85°C)
≤ +70°C)
©2009 Micron Technology, Inc. All rights reserved.
13.125
13.125
13.125
t
(ns)
12.5
RCD
15
15
13.125
13.125
13.125
(ns)
12.5
t
15
15
RP
Features
Marking
48.125
49.125
50.625
(ns)
52.5
52.5
None
t
-1G6
-1G4
-1G1
50
RC
T
Z

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MT36JSZF1G72PDZ-1G1D1 Summary of contents

Page 1

... DDR3 SDRAM RDIMM MT36JSZF51272PDZ – 4GB MT36JSZF1G72PDZ – 8GB Features • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, registered dual in-line memory module (RDIMM) • Fast data transfer rates: PC3-12800, PC3-10600, PC3-8500, or PC3-6400 • 4GB (512 Meg x 72), 8GB (1 Gig x 72) • ...

Page 2

... Density MT36JSZF1G72PDZ-1G6__ MT36JSZF1G72PTZ-1G6__ MT36JSZF1G72PDZ-1G4__ MT36JSZF1G72PTZ-1G4__ MT36JSZF1G72PDZ-1G1__ MT36JSZF1G72PTZ-1G1__ 1. The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT36JSZF51272PDZ-1G1F1. ...

Page 3

Pin Assignments and Descriptions Table 5: Pin Assignments 240-Pin DDR3 RDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ25 61 REFDQ DQ0 33 DQS3 DQ1 ...

Page 4

Table 6: Pin Descriptions Symbol Type Description A[15:0] Input Address inputs: Provide the row address for ACTIVATE commands, and the column ad- dress and auto precharge bit (A10) for READ/WRITE commands, to select one location out of the memory array ...

Page 5

... Termination voltage: Used for control, command, and address (V TT – connect: These pins are not connected on the module. – function: These pins are connected on the module, but have no function. PDF: 09005aef83950b83 JSZF36C512_1Gx72PDZ.pdf – Rev. A 8/09 EN 4GB, 8GB (x72, ECC, QR) 240-Pin Halogen-Free DDR3 RDIMM . /2). DD ...

Page 6

... DQ Map Table 7: Component-to-Module DQ Map, Front Component Reference Component Number DQ Module PDF: 09005aef83950b83 JSZF36C512_1Gx72PDZ.pdf – Rev. A 8/09 EN 4GB, 8GB (x72, ECC, QR) 240-Pin Halogen-Free DDR3 RDIMM Component Module Pin Reference Number Number 123 128 4 122 7 129 147 140 146 21 141 CB2 45 U8 CB1 ...

Page 7

... Table 7: Component-to-Module DQ Map, Front (Continued) Component Reference Component Number DQ Module DQ U11 U13 U15 U17 PDF: 09005aef83950b83 JSZF36C512_1Gx72PDZ.pdf – Rev. A 8/09 EN 4GB, 8GB (x72, ECC, QR) 240-Pin Halogen-Free DDR3 RDIMM Component Module Pin Reference Number Number 58 114 U12 60 227 59 115 56 108 62 233 61 228 ...

Page 8

... Table 7: Component-to-Module DQ Map, Front (Continued) Component Reference Component Number DQ Module DQ U19 Table 8: Component-to-Module DQ Map, Back Component Reference Component Number DQ Module DQ U21 U23 PDF: 09005aef83950b83 JSZF36C512_1Gx72PDZ.pdf – Rev. A 8/09 EN 4GB, 8GB (x72, ECC, QR) 240-Pin Halogen-Free DDR3 RDIMM Component Module Pin Reference Number ...

Page 9

... Table 8: Component-to-Module DQ Map, Back (Continued) Component Reference Component Number DQ Module DQ U25 U27 U29 U31 PDF: 09005aef83950b83 JSZF36C512_1Gx72PDZ.pdf – Rev. A 8/09 EN 4GB, 8GB (x72, ECC, QR) 240-Pin Halogen-Free DDR3 RDIMM Component Module Pin Reference Number Number CB5 159 U26 CB2 45 CB1 40 CB3 46 CB0 ...

Page 10

... Table 8: Component-to-Module DQ Map, Back (Continued) Component Reference Component Number DQ Module DQ U33 U35 U37 PDF: 09005aef83950b83 JSZF36C512_1Gx72PDZ.pdf – Rev. A 8/09 EN 4GB, 8GB (x72, ECC, QR) 240-Pin Halogen-Free DDR3 RDIMM Component Module Pin Reference Number Number 34 87 U34 36 200 206 37 201 39 207 U36 28 149 ...

Page 11

Functional Block Diagram Figure 2: Functional Block Diagram RS0# RS1# RS2# RS3# DQS0 DQS0# DM0/TDQS9 NF/TDQS9# DM/ NF/ CS# DQS DQS# DM/ NF/ CS# DQS DQS# TDQS TDQS# TDQS TDQS# DQ0 DQ DQ DQ1 DQ DQ DQ2 DQ DQ U12 ...

Page 12

... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...

Page 13

... TSE2002av, Serial Presence Detect with Temperature Sensor.” Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE- DEC standard JC-45 “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules.” ...

Page 14

... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...

Page 15

... Component specifications are available on Micron’s Web site. Module speed grades cor- relate with component speed grades, as shown below. Table 11: Module and Component Speed Grades DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1G6 ...

Page 16

... Self refresh temperature current (SRT-enabled): MAX T = 95°C C All banks interleaved read current Reset current 1. One module rank in the active I Notes: 2. All ranks in this I Table 13: DDR3 I Specifications and Conditions – 8GB DD Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) ...

Page 17

... Self refresh temperature current: MAX T Self refresh temperature current (SRT-enabled): MAX T = 95°C C All banks interleaved read current Reset current 1. One module rank in the active I Notes: 2. All ranks in this I PDF: 09005aef83950b83 JSZF36C512_1Gx72PDZ.pdf – Rev. A 8/09 EN 4GB, 8GB (x72, ECC, QR) 240-Pin Halogen-Free DDR3 RDIMM Symbol ...

Page 18

... RESET#, MIRROR 0.65 × V RESET#, MIRROR CK, CK#, FBIN, FBIN# 0.5 × V CK, CK# Err_Out# Err_Out# tion of the DDR3 SDRAM RDIMMs. These are meant subset of the parameters for the specific device used on the module. 18 Min Nom Max 1.425 1.5 1.575 - 20mV 0.5 × V 0.51 × ...

Page 19

... Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I Table 15: Temperature Sensor with Serial Presence-Detect EEPROM Operating Conditions Parameter/Condition Supply voltage Supply current 3.3V DD Input high voltage: Logic 1; SCL, SDA Input low voltage: Logic 0 ...

Page 20

The interrupt mode enables software to reset EVENT# after a critical temperature thresh- old has been detected. Threshold points are set in the configuration register by the user. This mode triggers the critical temperature limit and both the MIN and ...

Page 21

Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 17: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...

Page 22

Table 18: Pointer Register Bits 0– Table 19: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...

Page 23

Table 21: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 22: Configuration Register (Address: 0x01) 15 ...

Page 24

Table 23: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...

Page 25

Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 24: Hysteresis Applied to Alarm ...

Page 26

Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...

Page 27

Table 28: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 29: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...

Page 28

... TYP TYP 123.0 (4.84) TYP Back view U23 U24 U26 U27 U28 U33 U34 U35 U36 U37 5.0 (0.197) TYP 71.0 (2.79) TYP Module with heat spreader U14 U15 U16 U17 U18 U23 U24 U26 U27 U28 U33 U34 ...

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