MT9JSF25672AZ-1G4D1 Micron Technology Inc, MT9JSF25672AZ-1G4D1 Datasheet
MT9JSF25672AZ-1G4D1
Specifications of MT9JSF25672AZ-1G4D1
Related parts for MT9JSF25672AZ-1G4D1
MT9JSF25672AZ-1G4D1 Summary of contents
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... DDR3 SDRAM UDIMM MT9JSF12872AZ – 1GB MT9JSF25672AZ – 2GB MT9JSF51272AZ – 4GB Features • DDR3 functionality and operations supported as de- fined in the component data sheet • 240-pin, unbuffered dual in-line memory module (UDIMM) • Fast data transfer rates: PC3-12800, PC3-10600, PC3-8500, or PC3-6400 • ...
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... The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Con- sult factory for current revision codes. Example: MT9JSF25672AZ-1G1D1. PDF: 09005aef8360c8e6 jsf9c128_256_512x72az.pdf - Rev. C 9/09 EN ...
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... Table 5: Part Numbers and Timing Parameters – 4GB Modules 1 Base device: MT41J512M8, 4Gb DDR3 SDRAM Module 2 Part Number Density MT9JSF51272A(I)Z-1G6__ MT9JSF51272A(I)Z-1G4__ MT9JSF51272A(I)Z-1G1__ Notes: 1. The data sheet for the base device can be found on Micron’s Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Con- sult factory for current revision codes ...
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Pin Assignments and Descriptions Table 6: Pin Assignments 240-Pin DDR3 UDIMM Front Pin Symbol Pin Symbol Pin DQ25 61 REFDQ DQ0 33 DQS3 DQ1 34 DQS3 64 ...
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... Data strobe: DQS and DQS# are differential data strobes. Output with read data. Edge- aligned with read data. Input with write data. Center-aligned with write data. Serial data: SDA is a bidirectional pin used to transfer addresses and data into and out of the temperature sensor/SPD EEPROM on the module on the I 5 Pin Assignments and Descriptions ...
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... Reference voltage: Control, command, and address (V Reference voltage: DQ Ground. Termination voltage: Used for control, command, and address (V No connect: These pins are not connected on the module. No function: Connected within the module, but provides no functionality. 6 Pin Assignments and Descriptions and V are connected to the mod- DD DDQ /2) ...
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... DQ Map Table 8: Component-to-Module DQ Map Component Reference Component Number DQ Module PDF: 09005aef8360c8e6 jsf9c128_256_512x72az.pdf - Rev. C 9/09 EN 1GB, 2GB, 4GB (x72, ECC, SR) 240-Pin DDR3 SDRAM UDIMM Component Module Pin Reference Number Number 123 7 129 128 4 122 141 23 147 146 20 140 CB2 45 U6 CB5 159 ...
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... Table 8: Component-to-Module DQ Map (Continued) Component Reference Component Number DQ Module PDF: 09005aef8360c8e6 jsf9c128_256_512x72az.pdf - Rev. C 9/09 EN 1GB, 2GB, 4GB (x72, ECC, SR) 240-Pin DDR3 SDRAM UDIMM Component Module Pin Reference Number Number 58 114 61 228 63 234 56 108 62 233 60 227 59 115 57 109 8 Component DQ Module DQ Micron Technology, Inc. reserves the right to change products or specifications without notice. ...
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Functional Block Diagram Figure 2: Functional Block Diagram S0# DQS0# DQS0 DM0 DM CS# DQ DQS# DQ DQ0 DQ DQ1 DQ2 DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQS1# DQS1 DM1 DM CS# DQ DQS# ...
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... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...
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... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...
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... Component specifications are available on Micron’s Web site. Module speed grades cor- relate with component speed grades, as shown below. Table 11: Module and Component Speed Grades DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1G6 ...
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I Specifications DD Table 12: DDR3 I Specifications and Conditions – 1GB DD Values are for the MT41J128M8 DDR3 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet Parameter Operating current ...
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Table 13: DDR3 I Specifications and Conditions – 2GB (Continued) DD Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) component data sheet Parameter All banks interleaved read ...
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... TSE2002av, Serial Presence Detect with Temperature Sensor.” Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE- DEC standard JC-45, “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules.” ...
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Table 16: Sensor and EEPROM Serial Interface Timing (Continued) Parameter/Condition Start condition setup time Stop condition setup time EVENT# Pin The temperature sensor also adds the EVENT# pin (open drain). Not used by the SPD EEPROM, EVENT temperature ...
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Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 17: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...
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Table 18: Pointer Register Bits 0– Table 19: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...
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Table 21: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 22: Configuration Register (Address: 0x01) 15 ...
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Table 23: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...
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Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 24: Hysteresis Applied to Alarm ...
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Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...
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Table 28: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 29: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...
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... Front view 133.50 (5.256) 133.20 (5.244 U10 0.76 (0.030) R 1.0 (0.039) TYP 123.0 (4.84) TYP Back view No components this side of module 5.0 (0.197) TYP 71.0 (2.79) TYP 24 Module Dimensions U8 U9 23.3 (0.92) TYP 17.3 (0.68) TYP 9.5 (0.374) 0.80 (0.031) TYP ...
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... Updated parameter formatting throughout document • Options/Marking, table: Deleted last three lines and note 2 • Part Numbers and Timing Parameters – 1GB Modules, table: Deleted last three lines • Part Numbers and Timing Parameters – 2GB Modules, table: Deleted last three lines • ...