MT46V32M16D2TH-7L Micron Technology Inc, MT46V32M16D2TH-7L Datasheet - Page 3

• Manufacturer Part Number: MT46V32M16D2TH-7L
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46V32M16D2TH-7L

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 750ps
• Maximum Clock Rate: 266MHz
• Operating Supply Voltage (typ): 2.5V
• Package Type: TSOP
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Pin Count: 66
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

TABLE OF CONTENTS
Functional Block Diagram – 128 Meg x 4 .............
Functional Block Diagram – 64 Meg x 8 ...............
Functional Block Diagram – 32 Meg x 16 .............
Pin Descriptions ......................................................
Functional Description .........................................
Commands ............................................................ 13
Operation .............................................................. 16
512Mb: x4, x8, x16 DDR SDRAM
512Mx4x8x16DDR_A.p65 – Rev. A; Pub 10/00
Initialization ......................................................
Register Definition .............................................
Truth Table 1 (Commands)
Truth Table 1A (DM Operation)
Deselect .............................................................. 14
No Operation (NOP) .......................................... 14
Load Mode Register ........................................... 14
Active ................................................................ 14
Read
Write ................................................................ 14
Precharge ........................................................... 14
Auto Precharge .................................................. 14
Burst Terminate ................................................. 14
Auto Refresh ...................................................... 15
Self Refresh ......................................................... 15
Bank/Row Activation ....................................... 16
Reads ................................................................ 17
Writes ................................................................ 26
Mode Register ...............................................
Extended Mode Register ............................... 12
Read Burst .................................................... 18
Consecutive Read Bursts .............................. 19
Nonconsecutive Read Bursts ....................... 20
Random Read Accesses ................................ 21
Terminating a Read Burst ............................ 23
Read to Write ............................................... 24
Read to Precharge ......................................... 25
Write Burst .................................................... 27
Consecutive Write to Write ......................... 28
Nonconsecutive Write to Write .................. 29
Burst Length ............................................
Burst Type ................................................ 10
Read Latency ........................................... 11
Operating Mode ...................................... 11
DLL Enable/Disable ................................. 12
................................................................ 14
....................................... 13
................................. 13
4
5
6
7
9
9
9
9
9
3
Operating Conditions
Absolute Maximum Ratings .................................... 43
DC Electrical and Operating Conditions ..................... 43
AC Input Operating Conditions ............................. 43
Capacitance – x4, x8 .............................................. 44
I
Capacitance – x16 .................................................. 46
I
AC Electrical Characteristics (Timing Table) .......... 48
Slew Rate Derating Table ....................................... 49
Data Valid Window Derating ............................... 51
Voltage and Timing Waveforms
66-pin TSOP (TH) dimensions ............................... 69
66-pin TSOP (TG) dimensions ............................... 70
DD
DD
Precharge ........................................................... 37
Power-Down ..................................................... 37
Truth Table 2 (CKE)
Truth Table 3 (Current State, Same Bank)
Truth Table 4 (Current State, Different Bank)
Nominal Output Drive Curves ......................... 54
Reduced Output Drive Curves (x16 only) ........ 55
Output Timing –
Output Timing –
Output Timing –
Input Timing ..................................................... 58
Input Voltage .................................................... 59
Initialize and Load Mode Registers .................. 60
Power-Down Mode .......................................... 61
Auto Refresh Mode ........................................... 62
Self Refresh Mode ............................................. 63
Reads
Writes
Specifications and Conditions – x4, x8 ........... 45
Specifications and Conditions – x16 ............... 47
Random Writes ............................................ 30
Write to Read – Uninterrupting .................. 31
Write to Read – Interrupting ....................... 32
Write to Read – Odd, Interrupting ............. 33
Write to Precharge – Uninterrupting .......... 34
Write to Precharge – Interrupting ............... 35
Write to Precharge – Odd, Interrupting ...... 36
Bank Read - Without Auto Precharge ........ 64
Bank Read - With Auto Precharge .............. 65
Bank Write – Without Auto Precharge ....... 66
Bank Write – With Auto Precharge ............. 67
Write – DM Operation ................................ 68
Micron Technology, Inc., reserves the right to change products or specifications without notice.
................................................. 38
t
t
t
512Mb: x4, x8, x16
DQSQ and
DQSQ and
AC and
t
DQSCK ................. 58
DDR SDRAM
t
t
QH - x4, x8 ...... 56
QH - x16 .......... 57
..................... 39
©2000, Micron Technology, Inc.
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