MT9LSDT1672G-13EB1 Micron Technology Inc, MT9LSDT1672G-13EB1 Datasheet - Page 13

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MT9LSDT1672G-13EB1

Manufacturer Part Number
MT9LSDT1672G-13EB1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT9LSDT1672G-13EB1

Main Category
DRAM Module
Sub-category
SDRAM
Module Type
168RDIMM
Device Core Size
72b
Organization
16Mx72
Total Density
128MByte
Chip Density
128Mb
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Operating Current
1.485A
Number Of Elements
9
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Operating Temp Range
0C to 55C
Operating Temperature Classification
Commercial
Pin Count
168
Mounting
Socket
Lead Free Status / Rohs Status
Compliant
Module Dimensions
Figure 6:
PDF: 09005aef80a2e32f/Source: 09005aef80a2e30d
SD9C16_32x72.fm - Rev. D 1/08 EN
2.0 (0.079) R
3.0 (0.118) D
3.0 (0.118) TYP
(2X)
(2X)
3.0 (0.118)
168-Pin SDRAM RDIMM – Standard Layout
TYP
Notes:
U1
6.35 (0.25) TYP
Pin 168
Pin 1
U10
1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted.
2. The dimensional diagram is for reference only. Refer to the JEDEC MO document for addi-
tional design dimensions.
U2
U11
U5
128MB, 256MB (x72, ECC, SR): 168-Pin SDRAM RDIMM
Front view
133.50 (5.256)
133.20 (5.244)
Back view
115.57 (4.55)
U6
TYP
U12
1.0 (0.039) R (2X)
U7
13
42.18 (1.661)
TYP
U3
1.02 (0.04)
66.68 (2.625)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
TYP
TYP
U13
U4
1.27 (0.05)
TYP
U14
U9
Pin 84
Pin 85
Module Dimensions
3.25 (0.128)
3.0 (0.118)
©2003 Micron Technology, Inc. All rights reserved
17.78 (0.7)
TYP
38.23 (1.505)
37.97 (1.495)
1.37 (0.054)
1.17 (0.046)
4.0 (0.157)
MAX

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