MT47H16M16FG-3:B Micron Technology Inc, MT47H16M16FG-3:B Datasheet - Page 22
![](/photos/31/34/313419/mfg557-84-fbga_sml.jpg)
MT47H16M16FG-3:B
Manufacturer Part Number
MT47H16M16FG-3:B
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H16M16FG-3B.pdf
(128 pages)
Specifications of MT47H16M16FG-3:B
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
215mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H16M16FG-3:B
Manufacturer:
MICRON
Quantity:
1 000
Company:
Part Number:
MT47H16M16FG-3:B
Manufacturer:
ST
Quantity:
1 489
- Current page: 22 of 128
- Download datasheet (10Mb)
Table 7: Thermal Impedance
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Die Revision Package Substrate
B
Last shrink
target
1
2
60-ball
84-ball
60-ball
84-ball
Notes:
2-layer
4-layer
2-layer
4-layer
2-layer
4-layer
2-layer
4-layer
1. Thermal resistance data is based on a number of samples from multiple lots and should
2. This is an estimate; simulated number and actual results could vary.
be viewed as a typical number.
Airflow = 0m/s
θ JA (°C/W)
59.0
37.8
53.6
36.6
65
45
55
40
Airflow = 1m/s
Electrical Specifications – Absolute Ratings
θ JA (°C/W)
22
46.7
32.5
40.0
29.9
48
38
45
35
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR2 SDRAM
Airflow = 2m/s
θ JA (°C/W)
43.1
30.7
35.2
27.5
45
34
37
30
θ JB (°C/W)
©2003 Micron Technology, Inc. All rights reserved.
25.0
20.5
20.0
19.2
30
27
28
27
θ JC (°C/W)
4.4
5.2
5.0
6.0
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