MT49H16M36HU-18 IT:A Micron Technology Inc, MT49H16M36HU-18 IT:A Datasheet - Page 15

MT49H16M36HU-18 IT:A

Manufacturer Part Number
MT49H16M36HU-18 IT:A
Description
Manufacturer
Micron Technology Inc
Type
RLDRAMr
Datasheet

Specifications of MT49H16M36HU-18 IT:A

Organization
16Mx36
Address Bus
23b
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
882mA
Pin Count
144
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Not Compliant
Package Dimensions
Figure 6:
PDF: 09005aef80fe62fb/Source: 09005aef809f284b
576Mb_RLDRAM_II_CIO_D2.fm - Rev. H 6/09 EN
Solder ball material:
Eutectic (62% Sn,
36% Pb, 2% Ag) or
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.39 SMD
ball pads.
144X Ø0.51
Seating
plane
17 CTR
0.12 A
144-Ball µBGA
1 TYP
Notes:
A
12 11 10 9
1. All dimensions are in millimeters.
10.6 CTR
0.8 TYP
8.8 CTR
11 ±0.1
576Mb: x9, x18, x36 2.5V Vext, 1.8V Vdd, HSTL, CIO, RLDRAM II
10º TYP
4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
0.73 ±0.1
18.5 ±0.1
Ball A1 ID
15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
18.1 CTR
0.34 MIN
0.49 ±0.05
1.2 MAX
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID

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