MT47H256M4HQ-25E:G Micron Technology Inc, MT47H256M4HQ-25E:G Datasheet - Page 129
MT47H256M4HQ-25E:G
Manufacturer Part Number
MT47H256M4HQ-25E:G
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H256M4HQ-25EG.pdf
(134 pages)
Specifications of MT47H256M4HQ-25E:G
Organization
256Mx4
Density
1Gb
Address Bus
17b
Access Time (max)
400ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
145mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H256M4HQ-25E:G
Manufacturer:
MICRON
Quantity:
1 475
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Figure 80: ODT Timing for Entering and Exiting Power-Down Mode
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
CKE
Applicable modes
Applicable timing parameters
t
AOND/
Any mode except
self refresh mode
Synchronous
t
AOFD
First CKE latched LOW
t
ANPD (3
t
CKs)
Active power-down slow (asynchronous)
Precharge power-down (asynchronous)
Active power-down fast (synchronous)
t
AONPD/
t
AOND/
Synchronous or
t
Asynchronous
t
AOFPD (asynchronous)
AOFD (synchronous)
129
Micron Technology, Inc. reserves the right to change products or specifications without notice.
First CKE latched HIGH
1Gb: x4, x8, x16 DDR2 SDRAM
t
AXPD (8
t
CKs)
© 2004 Micron Technology, Inc. All rights reserved.
Any mode except
self refresh mode
t
AOND/
Synchronous
ODT Timing
t
AOFD
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