72T36115L4-4BBG Integrated Device Technology (Idt), 72T36115L4-4BBG Datasheet - Page 35

• Manufacturer Part Number: 72T36115L4-4BBG
• Description: FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 128K x 36 240-Pin BGA
• Manufacturer: Integrated Device Technology (Idt)

Specifications of 72T36115L4-4BBG

• Package: 240BGA
• Configuration: Dual
• Bus Directional: Uni-Directional
• Density: 4.5 Mb
• Organization: 128Kx36
• Data Bus Width: 36 Bit
• Timing Type: Asynchronous|Synchronous
• Expansion Type: Depth|Width
• Typical Operating Supply Voltage: 2.5 V
• Operating Temperature: 0 to 70 °C

HIGH-IMPEDANCE
as well as three-state types) of an IC to a disabled (high-impedance) state and
selects the one-bit bypass register to be connected between TDI and TDO.
During this instruction, data can be shifted through the bypass register from TDI
to TDO without affecting the condition of the IC outputs.
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync™ ™ ™ ™ ™ 36-BIT FIFO
1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
The optional High-Impedance instruction sets all outputs (including two-state
35
BYPASS
functional mode and selects the one-bit bypass register to be connected
between TDI and TDO. The BYPASS instruction allows serial data to be
transferred through the IC from TDI to TDO without affecting the operation of
the IC.
The required BYPASS instruction allows the IC to remain in a normal
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
FEBRUARY 4, 2009