C8051F336-GMR Silicon Laboratories Inc, C8051F336-GMR Datasheet - Page 23

• Manufacturer Part Number: C8051F336-GMR
• Description: Microcontrollers (MCU) 16KB 10ADC 10DAC 768Ram MCU Lead Free
• Manufacturer: Silicon Laboratories Inc

Specifications of C8051F336-GMR

• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Program Memory Type: Flash
• Program Memory Size: 16 KB
• Data Ram Size: 768 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: QFN-20
• 3rd Party Development Tools: KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F336DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• On-chip Dac: 10 bit
• Package: 20QFN
• Device Core: 8051
• Family Name: C8051F336
• Maximum Speed: 25 MHz
• Ram Size: 768 Byte
• Operating Temperature: -40 to 85 °C
• Lead Free Status / Rohs Status: Details

4. QFN-20 Package Specifications
Notes:
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220, variation VGGD except for
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small
A1
D2
E2
D
A
b
e
E
custom features D2, E2, Z, Y, and L which are toleranced per supplier designation.
Body Components.
2.00
0.80
0.00
0.18
2.00
Min
Table 4.1. QFN-20 Package Dimensions
Figure 4.1. QFN-20 Package Drawing
4.00 BSC.
0.50 BSC.
4.00 BSC.
0.90
0.02
0.25
2.15
2.15
Typ
Max
1.00
0.05
0.30
2.25
2.25
Rev.1.0
Dimension
aaa
bbb
ddd
eee
L1
L
Z
Y
C8051F336/7/8/9
0.45
0.00
Min
—
—
—
—
—
—
0.55
0.43
0.18
Typ
—
—
—
—
—
0.65
0.15
0.10
0.08
Max
0.15
0.05
—
—
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