DSPB56724AG Freescale Semiconductor, DSPB56724AG Datasheet - Page 6

• Manufacturer Part Number: DSPB56724AG
• Description: DSP 24BIT AUD 250MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Symphony™r
• Type: Audio Processorr

Specifications of DSPB56724AG

• Interface: Host Interface, I²C, SAI, SPI
• Clock Rate: 250MHz
• Non-volatile Memory: External
• On-chip Ram: 112kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Operating Temperature (min): 0C
• Operating Temperature (max): 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1.1.2
Table 3
1.1.3
To prevent high current conditions due to possible improper sequencing of the power supplies, use an external Schottky diode
as shown in
If an external Schottky diode is not used (to prevent a high current condition at power-up), then IO_VDD must be applied ahead
of Core_VDD, as shown in
6
Natural Convection, Junction-to-ambient thermal
resistance
Junction-to-case thermal resistance
Note:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Thermal resistance between the die and the case top surface as measured by the cold plate method
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
(MIL SPEC-883 Method 1012.1).
lists the thermal characteristics.
1,2
Figure
Thermal Characteristics
Power Requirements
Figure 4. Prevent High Current Conditions by Applying IO_VDD Before Core_VDD
Figure 3. Prevent High Current Conditions by Using External Schottky Diode
3, connected between the DSP56724/DSP56725 IO_VDD and Core_VDD power pins.
Symphony
Characteristic
Figure
4.
3
™
DSP56724/ DSP56725 Multi-Core Audio Processors, Rev. 2
Core_VDD
Core_VDD
IO_VDD
IO_VDD
Table 3. Thermal Characteristics
Single layer board
(1s)
Four layer board
(2s2p)
—
R
R
Symbol
θJC
θJA
or θ
or θ
Schottky
External
Diode
JA
JC
57 for 80 QFP
49 for 144 QFP
44 for 80 QFP
40 for 144 QFP
10 for 80 QFP
9 for 144 QFP
LQFP Values
Freescale Semiconductor
°
°
°
Unit
C/W
C/W
C/W