SPAKDSP303AG100 Freescale Semiconductor, SPAKDSP303AG100 Datasheet - Page 22

• Manufacturer Part Number: SPAKDSP303AG100
• Description: IC DSP 24BIT 100MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: DSP563xxr
• Type: Fixed Pointr

Specifications of SPAKDSP303AG100

• Interface: Host Interface, SSI, SCI
• Clock Rate: 100MHz
• Non-volatile Memory: ROM (576 B)
• On-chip Ram: 24kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Device Core Size: 24b
• Clock Freq (max): 100MHz
• Mips: 100
• Device Input Clock Speed: 100MHz
• Ram Size: 24KB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Specifications
2.3 Thermal Characteristics
2.4 DC Electrical Characteristics
2-2
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Thermal characterization parameter
Notes:
Supply voltage
Input high voltage
•
•
•
Input low voltage
•
•
•
Input leakage current
High impedance (off-state) input current (@ 2.4 V / 0.4 V)
Output high voltage
•
•
Output low voltage
•
•
Internal supply current
•
•
•
PLL supply current
Input capacitance
D[0–23], BG, BB, TA
MOD
JTAG/ESSI/SCI/Timer/HI08 pins
EXTAL
D[0–23], BG, BB, TA, MOD
All JTAG/ESSI/SCI/Timer/HI08 pins
EXTAL
TTL (I
CMOS (I
TTL (I
CMOS (I
In Normal mode
In Wait mode
In Stop mode
1
OH
OL
/IRQ
1.
2.
3.
4.
8
8
OH
OL
= 1.6 mA, open-drain pins I
= –0.4 mA)
1
Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided printed circuit board per
JEDEC Specification JESD51-3.
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88, with the exception that
the cold plate temperature is used for the case temperature.
These are simulated values. See note 1 for test board conditions.
These are simulated values. The test board has two 2-ounce signal layers and two 1-ounce solid ground planes internal to the
test board.
, RESET, PINIT/NMI and all
= 10 µA)
= –10 µA)
3
4
Characteristic
5
2
:
5,7
5
5
Characteristics
1
/IRQ
2
1
, RESET, PINIT
1
OL
= 6.7 mA)
Table 2-3.
Table 2-2.
DSP56303 Technical Data, Rev. 11
5,7
R
R
Symbol
θJC
θJA
Ψ
or θ
or θ
JT
DC Electrical Characteristics
Thermal Characteristics
JA
JC
TQFP Value
Symbol
I
V
V
I
V
V
V
V
V
I
I
CCW
C
V
CCS
V
CCI
I
TSI
56
11
IHP
IHX
CC
ILP
ILX
IN
OH
OL
IH
7
IN
IL
V
0.8 × V
CC
Min
–0.3
–0.3
–0.3
–10
–10
2.0
2.0
2.4
3.0
—
—
—
—
—
—
—
– 0.01
MAP-BGA
CC
Value
6
57
15
8
3
Typ
127
100
3.3
7.5
—
—
—
—
—
—
—
—
—
—
—
—
—
1
MAP-BGA
Freescale Semiconductor
Value
28
—
—
0.2 × V
Max
5.25
0.01
V
V
3.6
0.8
0.8
0.4
2.5
10
10
10
—
—
—
—
—
CC
CC
4
CC
°
°
°
Unit
C/W
C/W
C/W
Unit
mA
mA
mA
µA
µA
µA
pF
V
V
V
V
V
V
V
V
V
V
V