SPAKDSP303AG100 Freescale Semiconductor, SPAKDSP303AG100 Datasheet - Page 24

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SPAKDSP303AG100

Manufacturer Part Number
SPAKDSP303AG100
Description
IC DSP 24BIT 100MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
DSP563xxr
Type
Fixed Pointr
Datasheets

Specifications of SPAKDSP303AG100

Interface
Host Interface, SSI, SCI
Clock Rate
100MHz
Non-volatile Memory
ROM (576 B)
On-chip Ram
24kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
144-LQFP
Device Core Size
24b
Clock Freq (max)
100MHz
Mips
100
Device Input Clock Speed
100MHz
Ram Size
24KB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SPAKDSP303AG100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Specifications
2.5.2
The DSP56303 system clock is derived from the on-chip oscillator or is externally supplied. To use the on-chip
oscillator, connect a crystal and associated resistor/capacitor components to EXTAL and XTAL; examples are
shown in Figure 2-1
If an externally-supplied square wave voltage source is used, disable the internal oscillator circuit during bootup by
setting XTLD (PCTL Register bit 16 = 1—see the DSP56303 User’s Manual). The external square wave source
connects to
between the
2-4
Internal clock and CLKOUT cycle time with
PLL disabled
Instruction cycle time
Notes:
1.
2.
CLKOUT with
CLKOUT with
PLL disabled
C
PLL enabled
Characteristics
EXTAL
EXTAL
External Clock Operation
EXTAL
EXTAL
Fundamental Frequency
DF = Division Factor; Ef = External frequency; ET
PDF = Predivision Factor; T
See the PLL and Clock Generation section in the DSP56300 Family Manual for a detailed discussion of the PLL.
Crystal Oscillator
;
XTAL1
6a
XTAL
input and the internal clock and
V
.
ILX
R
is not physically connected to the board or socket. Figure 2-2 shows the relationship
ET
XTAL
H
C
Table 2-4.
2
5
C
Note: Make sure that in
the PCTL Register:
= internal clock cycle
Figure 2-1.
4
Figure 2-2.
XTLD (bit 16) = 0
If f
Symbol
ET
DSP56303 Technical Data, Rev. 11
XTLR (bit 15) = 0
OSC
I
CYC
L
T
C
Internal Clocks, CLKOUT (Continued)
> 200 kHz,
3
ET
6b
C
Crystal Oscillator Circuits
CLKOUT
C
External Clock Timing
= External clock cycle; MF = Multiplication Factor;
Min
.
Suggested Component Values:
f
R = 680 kΩ ± 10%
C = 56 pF ± 20%
Calculations were done for a 4/20 MHz crystal
with the following parameters:
OSC
C
C
series resistance of 100/20 Ω, and
drive level of 2 mW.
L
0
= 4 MHz
of 30/20 pF,
of 7/6 pF,
7
Midpoint
7
Note:
Expression
5
2 × ET
f
R = 680 kΩ ± 10%
C = 22 pF ± 20%
Typ
OSC
T
The midpoint is
0.5 (V
C
= 20 MHz
C
IHX
1, 2
V
+ V
IHX
Freescale Semiconductor
ILX
).
Max

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