EP1S25F780C6 Altera, EP1S25F780C6 Datasheet - Page 139
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EP1S25F780C6
Manufacturer Part Number
EP1S25F780C6
Description
IC STRATIX FPGA 25K LE 780-FBGA
Manufacturer
Altera
Series
Stratix®r
Datasheet
1.EP1S10F780C7.pdf
(276 pages)
Specifications of EP1S25F780C6
Number Of Logic Elements/cells
25660
Number Of Labs/clbs
2566
Total Ram Bits
1944576
Number Of I /o
597
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
780-FBGA
Family Name
Stratix
Number Of Logic Blocks/elements
25660
# I/os (max)
597
Frequency (max)
450.05MHz
Process Technology
0.13um (CMOS)
Operating Supply Voltage (typ)
1.5V
Logic Cells
25660
Ram Bits
1944576
Operating Supply Voltage (min)
1.425V
Operating Supply Voltage (max)
1.575V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
780
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant
Other names
544-1121
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP1S25F780C6
Manufacturer:
ALTERA
Quantity:
10
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Part Number:
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Manufacturer:
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Quantity:
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Manufacturer:
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Part Number:
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Figure 2–70. Stratix I/O Banks
Notes to
(1)
(2)
(3)
(4)
(5)
Altera Corporation
July 2005
PLL8
PLL7
PLL1
PLL2
Figure 2–70
will be a reverse view for flip-chip packages.
Figure 2–70
Quartus II software for exact locations.
Banks 9 through 12 are enhanced PLL external clock output banks.
If the high-speed differential I/O pins are not used for high-speed differential signaling, they can support all of the
I/O standards except HSTL Class I and II, GTL, SSTL-18 Class II, PCI, PCI-X 1.0, and AGP 1× /2× .
For guidelines for placing single-ended I/O pads next to differential I/O pads, see the Selectable I/O Standards in
Stratix and Stratix GX Devices chapter in the Stratix Device Handbook, Volume 2.
VREF1B3 VREF2B3 VREF3B3 VREF4B3 VREF5B3
VREF5B8 VREF4B8 VREF3B8 VREF2B8 VREF1B8
DQS9T
DQS9B
Figure
(5)
(5)
2–70:
DQS8T
DQS8B
is a top view of the silicon die. This will correspond to a top-down view for non-flip-chip packages, but
is a graphic representation only. See the device pin-outs on the web (www.altera.com) and the
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (4)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (4)
DQS7B
DQS7T
Bank 8
Bank 3
DQS6T
DQS6B
Notes
(1), (2),
DQS5T
DQS5B
I/O Banks 1, 2, 5, and 6 Support All
Single-Ended I/O Standards Except
Differential HSTL Output Clocks,
Differential SSTL-2 Output Clocks,
HSTL Class II, GTL, SSTL-18 Class II,
PCI, PCI-X 1.0, and AGP 1×/2×
I/O Banks 3, 4, 9 & 10 Support
All Single-Ended I/O Standards
I/O Banks 7, 8, 11 & 12 Support
All Single-Ended I/O Standards
(3)
11
9
PLL5
PLL6
10
12
PLL11
PLL12
VREF1B4 VREF2B4 VREF3B4 VREF4B4 VREF5B4
VREF5B7 VREF4B7 VREF3B7 VREF2B7 VREF1B7
DQS4T
DQS4B
and HyperTransport I/O Block
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
LVDS, LVPECL, 3.3-V PCML,
Stratix Device Handbook, Volume 1
DQS3B
DQS3T
and Regular I/O Pins (4)
and Regular I/O Pins (4)
DQS2T
DQS2B
Bank 7
Bank 4
DQS1T
DQS1B
Stratix Architecture
(5)
(5)
DQS0B
DQS0T
PLL10
PLL4
PLL3
PLL9
2–125