CY7C68014A-100AXC Cypress Semiconductor Corp, CY7C68014A-100AXC Datasheet - Page 37

• Manufacturer Part Number: CY7C68014A-100AXC
• Description: IC MCU USB PERIPH HI SPD 100LQFP
• Manufacturer: Cypress Semiconductor Corp
• Series: EZ-USB FX2LP™r

Specifications of CY7C68014A-100AXC

• Program Memory Type: ROMless
• Package / Case: 100-LQFP
• Applications: USB Microcontroller
• Core Processor: 8051
• Controller Series: CY7C680xx
• Ram Size: 16K x 8
• Interface: I²C, USB, USART
• Number Of I /o: 40
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Processor Series: CY7C68xx
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 16 KB
• Interface Type: I2C/USART/USB
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 40
• Number Of Timers: 3
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: CY3684
• Minimum Operating Temperature: 0 C
• Controller Family/series: (8051) USB
• Core Size: 8 Bit
• No. Of I/o's: 40
• Program Memory Size: 16KB
• Cpu Speed: 48MHz
• No. Of Timers: 3
• Embedded Interface Type: I2C, USART, USB
• Rohs Compliant: Yes
• Package: 100TQFP
• Device Core: 8051
• Family Name: FX2LP
• Maximum Speed: 48 MHz
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: CY4611B - KIT USB TO ATA REFERENCE DESIGN
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 428-1670

5. Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage temperature ................................ –65 C to +150 C
Ambient temperature with
power supplied (commercial)........................ 0 C to +70 C
Ambient temperature with
power supplied (industrial)....................... –40 C to + 105 C
Supply voltage to ground potential ...............–0.5 V to +4.0 V
DC input voltage to any input pin
DC voltage applied to outputs
in high Z state ..................................... –0.5 V to V
Power dissipation ..................................................... 300 mW
Static discharge voltage............. ...............................>2000 V
Max output current, per I/O port .................................. 10 mA
Max output current, all five I/O ports
(128-pin and 100-pin packages) .................................. 50 mA
7. Thermal Characteristics
The following table displays the thermal characteristics of various packages:
Table 7-1. Thermal Characteristics
The junction temperature 
Where,
P = Power


The case temperature 
where,
P = Power


Document #: 38-08032 Rev. *T
Package
56 SSOP
100 TQFP
128 TQFP
56 QFN
56 VFBGA
Note
Ja
a
Ca
a
15. Do not power I/O with chip power off.
= Ambient temperature (70 °C)
= Ambient temperature (70 °C)
= Junction to ambient temperature (
= Case to ambient temperature
Ambient Temperature
c
, can be calculated using the following equation: 
(°C)
j
, can be calculated using the following equation: 

70
70
70
70
70
a
[15]
............................ 5.25 V
Jc
Junction to Case
+ 
Temperature
Ca
(°C/W)
)

24.4
11.9
15.5
10.6
30.9
CC
Jc
+ 0.5 V
Case to Ambient
Temperature
6. Operating Conditions
T
Commercial .................................................... 0 °C to +70 °C
T
Industrial ................................................... –40 °C to +105 °C
Supply voltage ..........................................+3.00 V to +3.60 V
Ground voltage ................................................................. 0 V
F
A
A
OSC
(°C/W)

23.3
34.0
27.7
14.6
27.7
(ambient temperature under bias)
(ambient temperature under bias)
Ca
(oscillator or crystal frequency) ..... 24 MHz ± 100 ppm,
c
= P*
j
= P*
Ca
Ja
+ 
CY7C68013A, CY7C68014A
CY7C68015A, CY7C68016A
+ 
Junction to Ambient Temperature
a
a

Jc +
(°C/W)
47.7
45.9
43.2
25.2
58.6

Ja

Ca
parallel resonant
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