STA2062 STMicroelectronics, STA2062 Datasheet
STA2062
Specifications of STA2062
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STA2062 Summary of contents
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... HCMOS 0.90µm process ■ Package: – LFBGA16x16x1.4 mm (19x19balls) – 0.8 mm ball pitch, (0.4 mm ball) – Full array ■ Ambient temperature range: -40 / +85 °C Table 1. Device summary Order code Package STA2062 LFBGA361 Rev 3 STA2062 Data Brief : 1.2 ±10 1.8 V ± Packing Tray 1/5 www.st.com 5 ...
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... Description 1 Description The STA2062 is an highly integrated SOC application processor combining host capability with embedded GPS. STA2062 targets in vehicle and mobile navigation (PND), telematics, advance audio and connectivity systems. Figure 1: Block diagram ARM926 microcontroller and its peripherals are interfaced. Block diagram Figure 1 ...
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... STA2062 2 Package information In order to meet environmental requirements, ST offers this device in ECOPACK This package has a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... Revision history 3 Revision history Table 2. Document revision history Date 3-Oct-2007 12-Oct-2007 11-Apr-2008 4/5 Revision 1 Initial release. 2 Minor changes. 3 Typo and graphic errors correction. STA2062 Changes ...
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... STA2062 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...