PNX1501E,557 NXP Semiconductors, PNX1501E,557 Datasheet - Page 226
PNX1501E,557
Manufacturer Part Number
PNX1501E,557
Description
IC MEDIA PROC 266MHZ 456-BGA
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1502EG557.pdf
(828 pages)
Specifications of PNX1501E,557
Applications
Multimedia
Core Processor
TriMedia
Controller Series
Nexperia
Interface
I²C, 2-Wire Serial
Number Of I /o
61
Voltage - Supply
1.14 V ~ 1.26 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
456-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Program Memory Type
-
Ram Size
-
Other names
935274728557
PNX1501E
PNX1501E
PNX1501E
PNX1501E
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PNX1501E,557
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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Philips Semiconductors
Volume 1 of 1
PNX15XX_SER_3
Product data sheet
t
t
t
Figure 2:
WH
WL
RL
: (REN_lo + 1) * pci_clk periodShown with REN_lo = 1
: (WEN_lo + 1) * pci_clk periodShown with WEN_lo = 0
: (WEN_hi + 1) * pci_clk period Shown with WEN_hi = 0
pci_clk
frame
WEN
REN
CLE
trdy
irdy
CS
IO
Read Status
The ACK may be monitored to determine when the device is ready prior to initiating
the DMA. Once the device is ready, no further monitoring of the ACK takes place. If
the amount of data to be transferred exceeds one segment, the max burst size should
be set to 128 to allow for pause in the transfer that allows the ACK to be monitored
between segments. Note that this approach will not pause at the correct location if the
spare area is being accessed.
Examples of block erase, data read and write and status read are shown in the
following timing diagrams.
command_a
Rev. 3 — 17 March 2006
t
WL
t
WH
t
status
RL
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Chapter 7: PCI-XIO Module
PNX15xx Series
7-7
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