STPCI2GDYI STMicroelectronics, STPCI2GDYI Datasheet - Page 70

• Manufacturer Part Number: STPCI2GDYI
• Description: IC SYSTEM-ON-CHIP X86 516-PBGA
• Manufacturer: STMicroelectronics

Specifications of STPCI2GDYI

• Applications: Graphics Controller
• Core Processor: x86
• Controller Series: STPC® Atlas
• Interface: UART
• Number Of I /o: 16
• Voltage - Supply: 2.45 V ~ 2.7 V
• Operating Temperature: -40°C ~ 115°C
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Type: -
• Ram Size: -
• Lead Free Status / Rohs Status: Compliant

STPC® ATLAS
5.2. 516-PIN PACKAGE THERMAL DATA
516-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
70/108
1
Figure 5-4. 516-Pin PBGA Structure
Figure 5-5. Thermal Dissipation Without Heatsink
Board
Signal layers
Ambient
Case
Junction
Board
Ambient
Rca
Rjc
Rjb
Rba
Board
8.5
Rja = 13 °C/W
6
Junction
Thermal balls
Ambient
6
125
Case
The structure in shown in
Thermal dissipation options are illustrated in
Figure 5-5
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
Airflow = 0
Board temperature taken at the centre balls
and
Figure
Power & Ground layers
5-6.
Figure
5-4.