CY8C20446-24LQXIT Cypress Semiconductor Corp, CY8C20446-24LQXIT Datasheet - Page 27
![no-image](/images/manufacturer_photos/0/1/179/cypress_semiconductor_corp_sml.jpg)
CY8C20446-24LQXIT
Manufacturer Part Number
CY8C20446-24LQXIT
Description
IC CAPSENSE AP 16K 2048B 32UQFN
Manufacturer
Cypress Semiconductor Corp
Series
CapSense® Controllersr
Specifications of CY8C20446-24LQXIT
Applications
Capacitive Sensing
Core Processor
M8C
Program Memory Type
FLASH (16 kB)
Controller Series
CY8C20xx6
Ram Size
2K x 8
Interface
I²C, SPI
Number Of I /o
28
Voltage - Supply
1.71 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-UQFN Exposed Pad, 32-HUQFN, 32-SQFN
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Technology
CMOS
Processing Unit
Microprocessor
Operating Supply Voltage (min)
1.71V
Operating Supply Voltage (typ)
1.8/2.5/3.3/5V
Operating Supply Voltage (max)
5.5V
Package Type
QFN EP
Screening Level
Industrial
Pin Count
32
Mounting
Surface Mount
Rad Hardened
No
Processor Series
CY8C20x46
Core
M8C
Development Tools By Supplier
CY3280-20X66
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
Document Number: 001-12696 Rev. *D
0.088
0.092
0.025
BSC
25
24
NOTES:
1.
2. BASED ON REF JEDEC # MO-248
3. PACKAGE WEIGHT: 0.0388g
4. DIMENSIONS ARE IN MILLIMETERS
HATCH AREA IS SOLDERABLE EXPOSED PAD
0.620
0.630
TOP VIEW
0.008
0.0135
Figure 16. 32-Pin (5x5 x 0.6 mm) QFN
Figure 17. 48-Pin (300 MIL) SSOP
48
1
0.008
0.016
.020
0.292
0.299
0.095
0.110
SIDE VIEW
0.395
0.420
SEATING PLANE
0.004
GAUGE PLANE
CY8C20x36/46/66, CY8C20396
.010
DIMENSIONS IN INCHES MIN.
0°-8°
BOTTOM VIEW
SEE NOTE 1
TITLE
SIZE
A
(SAWN TYPE)
32L QFN 5 X 5 X 0.55 MM PACKAGE OUTLINE 3.5 X 3.5 EPAD
PART NO.
CYPRESS
COMPANY CONFIDENTIAL
LQ32
0.024
0.040
DWG NO
001-42168 *C
001-42168
Page 27 of 34
51-85061 *C
REV
*C
MAX.
0.005
0.010
[+] Feedback