PIC10F200T-E/OT Microchip Technology, PIC10F200T-E/OT Datasheet - Page 85

• Manufacturer Part Number: PIC10F200T-E/OT
• Description: IC PIC MCU FLASH 256X12 SOT23-6
• Manufacturer: Microchip Technology
• Series: PIC® 10Fr

Specifications of PIC10F200T-E/OT

• Core Size: 8-Bit
• Program Memory Size: 384B (256 x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 3
• Program Memory Type: FLASH
• Ram Size: 16 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: SOT-23-6
• Controller Family/series: PIC10
• No. Of I/o's: 4
• Ram Memory Size: 16Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Digital Ic Case Style: SOT-23
• Processor Series: PIC10F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 16 B
• Interface Type: USB
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• Package: 6SOT-23
• Device Core: PIC
• Family Name: PIC10
• Maximum Speed: 4 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINXLT06SOT - SOCKET TRAN ICE 6SOT W/CABLEAC164321 - MODULE SKT 6L PM3 SOT23AC164037 - MODULE SKT 6L PROMATE II SOT23
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC10F200T-E/OT; PIC10F200T-E/OTTR

© 2007 Microchip Technology Inc.
6-Lead Plastic Small Outline Transistor (OT) [SOT-23]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
LASER MARK
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIN 1 ID BY
Number of Pins
Pitch
Outside Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
A1
A
N
1
e
2
D
e1
4
3
Dimension Limits
b
E1
PIC10F200/202/204/206
Units
A2
A1
E1
e1
L1
A2
N
A
E
D
e
L
φ
c
b
E
c
0.90
0.89
0.00
2.20
1.30
2.70
0.10
0.35
0.08
0.20
MIN
0°
MILLIMETERS
0.95 BSC
1.90 BSC
NOM
Microchip Technology Drawing C04-028B
6
–
–
–
–
–
–
–
–
–
–
–
MAX
1.45
1.30
0.15
3.20
1.80
3.10
0.60
0.80
0.26
0.51
30°
L1
L
DS41239D-page 83
φ