PIC10F200T-E/OT Microchip Technology, PIC10F200T-E/OT Datasheet - Page 87
![IC PIC MCU FLASH 256X12 SOT23-6](/photos/6/59/65928/sot-23-6_pkg_sml.jpg)
PIC10F200T-E/OT
Manufacturer Part Number
PIC10F200T-E/OT
Description
IC PIC MCU FLASH 256X12 SOT23-6
Manufacturer
Microchip Technology
Series
PIC® 10Fr
Datasheets
1.PIC10F200T-IOT.pdf
(96 pages)
2.PIC10F200T-IOT.pdf
(6 pages)
3.PIC10F200T-IOT.pdf
(18 pages)
4.AC162052.pdf
(54 pages)
Specifications of PIC10F200T-E/OT
Core Size
8-Bit
Program Memory Size
384B (256 x 12)
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
3
Program Memory Type
FLASH
Ram Size
16 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
SOT-23-6
Controller Family/series
PIC10
No. Of I/o's
4
Ram Memory Size
16Byte
Cpu Speed
4MHz
No. Of Timers
1
Digital Ic Case Style
SOT-23
Processor Series
PIC10F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
16 B
Interface Type
USB
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
4
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Package
6SOT-23
Device Core
PIC
Family Name
PIC10
Maximum Speed
4 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINXLT06SOT - SOCKET TRAN ICE 6SOT W/CABLEAC164321 - MODULE SKT 6L PM3 SOT23AC164037 - MODULE SKT 6L PROMATE II SOT23
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Other names
PIC10F200T-E/OT
PIC10F200T-E/OTTR
PIC10F200T-E/OTTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
E
A
NOTE 2
EXPOSED PAD
Units
PIC10F200/202/204/206
A1
A3
D2
E2
N
A
D
E
K
e
b
L
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
MIN
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
2.00 BSC
3.00 BSC
0.20 REF
NOM
0.90
0.02
0.25
0.40
8
–
–
–
Microchip Technology Drawing C04-123B
D2
2
e
1
N
MAX
1.00
0.05
1.75
1.90
0.30
0.50
–
E2
NOTE 1
DS41239D-page 85