PIC10F200T-E/OT Microchip Technology, PIC10F200T-E/OT Datasheet - Page 86
![IC PIC MCU FLASH 256X12 SOT23-6](/photos/6/59/65928/sot-23-6_pkg_sml.jpg)
PIC10F200T-E/OT
Manufacturer Part Number
PIC10F200T-E/OT
Description
IC PIC MCU FLASH 256X12 SOT23-6
Manufacturer
Microchip Technology
Series
PIC® 10Fr
Datasheets
1.PIC10F200T-IOT.pdf
(96 pages)
2.PIC10F200T-IOT.pdf
(6 pages)
3.PIC10F200T-IOT.pdf
(18 pages)
4.AC162052.pdf
(54 pages)
Specifications of PIC10F200T-E/OT
Core Size
8-Bit
Program Memory Size
384B (256 x 12)
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
3
Program Memory Type
FLASH
Ram Size
16 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
SOT-23-6
Controller Family/series
PIC10
No. Of I/o's
4
Ram Memory Size
16Byte
Cpu Speed
4MHz
No. Of Timers
1
Digital Ic Case Style
SOT-23
Processor Series
PIC10F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
16 B
Interface Type
USB
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
4
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Package
6SOT-23
Device Core
PIC
Family Name
PIC10
Maximum Speed
4 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINXLT06SOT - SOCKET TRAN ICE 6SOT W/CABLEAC164321 - MODULE SKT 6L PM3 SOT23AC164037 - MODULE SKT 6L PROMATE II SOT23
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Other names
PIC10F200T-E/OT
PIC10F200T-E/OTTR
PIC10F200T-E/OTTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PIC10F200/202/204/206
DS41239D-page 84
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
E1
b1
N
D
A
E
e
L
c
b
A2
.015
.290
.240
.348
.115
.008
.040
.014
MIN
.115
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–