MPC8560PX833LB Freescale Semiconductor, MPC8560PX833LB Datasheet - Page 69

• Manufacturer Part Number: MPC8560PX833LB
• Description: IC MPU POWERQUICC III 783-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8560PX833LB

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 833MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• Family Name: MPC85XX
• Device Core: PowerQUICC III
• Device Core Size: 32b
• Frequency (max): 833MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2V
• Operating Supply Voltage (max): 1.26V
• Operating Supply Voltage (min): 1.14V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 783
• Package Type: FCBGA
• For Use With: MPC8560ADS-BGA - BOARD APPLICATION DEV 8560
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

14 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
14.1
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783
flip chip plastic ball grid array (FC-PBGA).
Freescale Semiconductor
Die size
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8560 FC-PBGA
MPC8560 Integrated Processor Hardware Specifications, Rev. 5
783
1 mm
3.07 mm
3.75 mm
62 Sn/36 Pb/2 Ag
0.5 mm
12.2 mm × 9.5 mm
29 mm × 29 mm
Package and Pin Listings
69