MPC8360EVVAJDGA Freescale Semiconductor, MPC8360EVVAJDGA Datasheet - Page 99
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MPC8360EVVAJDGA
Manufacturer Part Number
MPC8360EVVAJDGA
Description
IC MPU POWERQUICC II PRO 740TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Specifications of MPC8360EVVAJDGA
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
533MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
740-TBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8360E-RDK
Maximum Clock Frequency
533 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
533MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
TBGA
No. Of Pins
740
Rohs Compliant
Yes
For Use With
MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8360EVVAJDGA
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MPC8360EVVAJDGA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8360EVVAJDGA
Manufacturer:
FREESCALE
Quantity:
20 000
(edge) of the package will be approximately the same as the local air temperature near the device.
Specifying the local ambient conditions explicitly as the board temperature provides a more precise
description of the local ambient conditions that determine the temperature of the device. At a known board
temperature, the junction temperature is estimated using the following equation:
where:
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
23.2.3
To determine the junction temperature of the device in the application after prototypes are available, the
Thermal Characterization Parameter (Ψ
measurement of the temperature at the top center of the package case using the following equation:
where:
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
23.2.4
In some application environments, a heat sink will be required to provide the necessary thermal
management of the device. When a heat sink is used, the thermal resistance is expressed as the sum of a
junction to case thermal resistance and a case to ambient thermal resistance:
where:
Freescale Semiconductor
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
T
T
R
P
T
T
Ψ
P
R
J
B
J
T
θ
D
D
θ
JT
JA
JA
= junction temperature (°C)
= junction temperature (°C)
= thermocouple temperature on top of package (°C)
= board temperature at the package perimeter (°C)
= power dissipation in the package (W)
= power dissipation in the package (W)
Experimental Determination of Junction Temperature
Heat Sinks and Junction-to-Ambient Thermal Resistance
= junction-to-ambient thermal resistance (°C/W)
= junction to board thermal resistance (°C/W) per JESD51-8
= junction-to-ambient thermal resistance (°C/W)
T
T
R
J
J
θ
JA
= T
= T
= R
B
T
+ (
+ (R
θ
JC
Ψ
θ
JT
+ R
JB
× P
× P
θ
CA
D
D
)
)
JT
) can be used to determine the junction temperature with a
Thermal
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