FTR-B3GA003Z-B10 Fujitsu, FTR-B3GA003Z-B10 Datasheet - Page 12

• Manufacturer Part Number: FTR-B3GA003Z-B10
• Description: Low Signal Relays - PCB SIGNAL
• Manufacturer: Fujitsu

Specifications of FTR-B3GA003Z-B10

• Contact Form: 2 Form C (DPDT)
• Coil Voltage: 3 V
• Coil Type: Non-Latching
• Power Consumption: 140 mW
• Termination Style: SMD
• Maximum Switching Current: 1 A
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3. Moisture sensitivity
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4. tin Whisker
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roHs Compliance and Lead Free relay Information
1. General Information
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Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)
2. Recommended Lead Free Solder Profile
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Reflow Solder condition
Moisture Sensitivity Level standard is not applicable to electromechanical realys.
SnAgCu and SnCuNi solder is known as low risk of tin whisker. No considerable whisker length was found
by our in-house test.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that
are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).
“LF” is marked on each outer and inner carton. (No marking on individual relays).
To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
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Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
All signal and power relays also comply with RoHS. Please refer to individual data
It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from
February 2005.
Sn-3.0CU-Ni will be used for the FTR-B3 and FTR-B4 series relays.
220
250
170
130
We will ship leaded relays as long as the leaded relay inventory exists.
We highly recommend that you confirm your actual solder conditions
Pre-heating
90~120 sec.
max. 120 sec.
Peak Temp.: max. 250°C
Soldering
20~30 sec.
(duration)
Cooling
Ftr-B3 series
Flow Solder condition:
Pre-heating:
Soldering:
Solder by Soldering Iron:
Soldering Iron
Temperature:
Duration:
maximum 120˚C
dip within 5 sec. at
260˚C solder bath
maximum 360˚C
maximum 3 sec.
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