MPC8360VVALFH Freescale Semiconductor, MPC8360VVALFH Datasheet - Page 98

• Manufacturer Part Number: MPC8360VVALFH
• Description: IC MPU PWRQUICC II 740-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8360VVALFH

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 667MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 740-TBGA
• For Use With: MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

Thermal
23.2
For the following sections, P
See
23.2.1
An estimation of the chip junction temperature, T
where:
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single-layer board is
appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity T
23.2.2
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
98
Junction-to-package natural convection on top
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-2 and SEMI G38-87 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal. 1 m/sec is approximately equal to 200 linear feet per minute (LFM).
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1).
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
Table 6
T
T
R
P
A
J
θ
D
Thermal Management Information
JA
= junction temperature (°C)
= ambient temperature for the package (°C)
= power dissipation in the package (W)
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
for typical power dissipations values.
= junction-to-ambient thermal resistance (°C/W)
T
Table 77. Package Thermal Characteristics for the TBGA Package (continued)
J
= T
A
+ (R
Characteristic
θ
JA
D
= (V
× P
D
DD
)
× I
DD
) + P
I/O
J
, can be obtained from the equation:
where P
I/O
is the power dissipation of the I/O drivers.
Symbol
ψ
JT
J
– T
Value
A
1
) are possible.
Freescale Semiconductor
°C/W
Unit
Notes
6