TDA8034HN/C1,151 NXP Semiconductors, TDA8034HN/C1,151 Datasheet - Page 13

• Manufacturer Part Number: TDA8034HN/C1,151
• Description: IC SMARD CARD INTERFACE 24HVQFN
• Manufacturer: NXP Semiconductors
• Type: Smart Card Interfacer

Specifications of TDA8034HN/C1,151

• Package / Case: 24-VQFN Exposed Pad, 24-HVQFN, 24-SQFN, 24-DHVQFN
• Controller Type: Smart Card Interface
• Interface: Analog
• Voltage - Supply: 1.8V, 3V, 5V
• Current - Supply: 65mA
• Operating Temperature: -25°C ~ 85°C
• Mounting Type: Surface Mount
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935288352151

NXP Semiconductors
9. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
TDA8034HN
Product data sheet
Symbol
V
V
V
V
T
P
T
T
V
Fig 10. Operation of debounce feature with pins OFFN, CMDVCCN, PRESN and V
stg
j
amb
DDP
DD
DD(INTF)
I
tot
ESD
(1) Deactivation caused by card withdrawal.
(2) Deactivation caused by short-circuit.
Limiting values
Parameter
power supply voltage
supply voltage
interface supply voltage
input voltage
storage temperature
total power dissipation
junction temperature
ambient temperature
electrostatic discharge voltage
CMDVCCN
PRESN
OFFN
V
CC
Remark: All card contacts are protected against any short-circuit to any other card
contact. Stress beyond the levels indicated in
the device. This is a short-term stress rating only and under no circumstances implies
functional operation under long-term stress conditions.
All information provided in this document is subject to legal disclaimers.
t
deb
Conditions
pin V
pin V
pin V
pins CMDVCCN, CLKDIV1, CLKDIV2,
VCC_SEL1, VCC_SEL2, RSTIN, OFFN,
PORADJ, XTAL1, XTAL2, I/OUC, AUX1UC,
AUX1UC
card contact pins PRESN, I/O, RST, AUX1,
AUX2 and CLK
T
Human Body Model (HBM) on card pins I/O,
RST, V
within typical application
Human Body Model (HBM); all other pins
Machine Model (MM); all pins
Field Charged Device Model (FCDM); all
pins
Rev. 3.0. — 17 January 2011
amb
DDP
DD
DD(INTF)
= −25 °C to +85 °C
CC
, AUX1, AUX2, CLK, PRESN;
(1)
Table 5
t
deb
can cause permanent damage to
CC
TDA8034HN
Min
−0.3
−0.3
−0.3
−0.3
−0.3
−55
-
-
−25
−6
−2
−200
−500
(2)
Smart card interface
001aal411
© NXP B.V. 2011. All rights reserved.
+125
Max
+6
+4.6
+4.6
+4.6
+6
+150
0.25
+85
+6
+2
+200
+500
Unit
V
V
V
V
V
°C
W
°C
°C
kV
kV
V
V
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