ST7538QTR STMicroelectronics, ST7538QTR Datasheet - Page 42

IC TXRX FSK POWER LINE 44-TQFP

ST7538QTR

Manufacturer Part Number
ST7538QTR
Description
IC TXRX FSK POWER LINE 44-TQFP
Manufacturer
STMicroelectronics
Type
Transceiverr
Datasheet

Specifications of ST7538QTR

Number Of Drivers/receivers
1/1
Voltage - Supply
4.75 V ~ 5.25 V
Mounting Type
Surface Mount
Package / Case
44-TQFP Exposed Pad, 44-eTQFP, 44-HTQFP, 44-VQFP
For Use With
497-5484 - BOARD EVAL ST7538 PWR LINE TXRX
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Protocol
-
Other names
497-5526-2

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STM
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0
Package mechanical data
7
42/44
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at:
Best thermal performance is achieved when slug is soldered to PCB.
It is recommended to have five solder dots (See
Copper slug to the ground layer on the soldering side. Moreover it is recommitted to connect
the ground layer on the soldering side to another ground layer on the opposite side with 15
to 20 vias.
It is suggested to not use the PCB surface below the slug area to interconnect any pin
except ground pins.
Figure 26. ST7538Q slug drawing
Figure 27. Soldering information
Cu plate
A
L1
L
Solder dots
B
Solder plated
Copper Slug
L
D03IN1413
L1
www.st.com
If PCB with ground layer, connect
copper plate with 15 to 20 vias
Figure
L1 (Copper plate)
Package Sizes
27) without resist to connect the
Lead frame
A
B
L
D03IN1414
10x10x1.4mm
10.00 mm
2.00 mm
1.00 mm
6.00 mm
0.10mm ±0.05
ST7538Q

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