MCP23S08-E/SO Microchip Technology Inc., MCP23S08-E/SO Datasheet - Page 35

• Manufacturer Part Number: MCP23S08-E/SO
• Description: 8-BIT INPUT/OUTPUT EXPANDER, SPI INTERFACE
• Manufacturer: Microchip Technology Inc.
• Type: Programmable Peripheral Interfacer

Specifications of MCP23S08-E/SO

• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

© 2007 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
e
α
E1
A2
E
Units
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
MCP23008/MCP23S08
φ
MIN
2.05
0.10
0.25
0.40
0.20
0.31
L
0°
5°
5°
–
h
L1
MILLMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-051B
h
β
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
–
DS21919D-page 35
c