MCP23S08-E/SO Microchip Technology Inc., MCP23S08-E/SO Datasheet - Page 41

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MCP23S08-E/SO

Manufacturer Part Number
MCP23S08-E/SO
Description
8-BIT INPUT/OUTPUT EXPANDER, SPI INTERFACE
Manufacturer
Microchip Technology Inc.
Type
Programmable Peripheral Interfacer
Datasheet

Specifications of MCP23S08-E/SO

Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP23S08-E/SO
Manufacturer:
HIMAX
Quantity:
1 450
Part Number:
MCP23S08-E/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2007 Microchip Technology Inc.
Device
Temperature
Range
Package
PART NO.
Device
Temperature
Range
MCP23008:
MCP23008T:
MCP23S08:
MCP23S08T:
E
* While these devices are only offered in the “E”
temperature range, the device will operate at different
voltages and temperatures as identified in the
Section 2.0 “Electrical Characteristics”.
ML
P
SO
SS
X
=
=
=
=
=
Plastic Quad Flat, No Lead Package
Plastic DIP (300 mil Body), 18-Lead
Plastic SOIC (300 mil Body), 18-Lead
SSOP, (209 mil Body, 5.30 mm), 20-Lead
Package
-40°C to +125°C (Extended) *
4x4x0.9 mm Body (QFN), 20-Lead
/XX
8-Bit I/O Expander w/ I
8-Bit I/O Expander w/ I
(Tape and Reel)
8-Bit I/O Expander w/ SPI Interface
8-Bit I/O Expander w/ SPI Interface
(Tape and Reel)
2
2
C™ Interface
C Interface
MCP23008/MCP23S08
Examples:
a)
b)
c)
d)
e)
f)
a)
b)
c)
d)
e)
f)
MCP23008-E/P:
MCP23008-E/SO: Extended Temp.,
MCP23008T-E/SO: Tape and Reel,
MCP23008-E/SS:
MCP23008T-E/SS: Tape and Reel,
MCP23008-E/ML:
MCP23S08-E/P:
MCP23S08-E/SO: Extended Temp.,
MCP23S08T-E/SO: Tape and Reel,
MCP23S08-E/SS: Extended Temp.,
MCP23S08T-E/SS: Tape and Reel,
MCP23S08T-E/MF: Tape and Reel,
.
Extended Temp.,
18LD PDIP package.
18LD SOIC package.
Extended Temp.,
18LD SOIC package.
Extended Temp.,
20LD SSOP package.
Extended Temp.,
20LD SSOP package.
Extended Temp.,
20LD QFN package.
Extended Temp.,
18LD PDIP package.
18LD SOIC package.
Extended Temp.,
18LD SOIC package.
20LD SSOP package.
Extended Temp.,
20LD SSOP package.
Extended Temp.,
20LD QFN package.
DS21919D-page 41

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