MCP23S08-E/SO Microchip Technology Inc., MCP23S08-E/SO Datasheet - Page 36

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MCP23S08-E/SO

Manufacturer Part Number
MCP23S08-E/SO
Description
8-BIT INPUT/OUTPUT EXPANDER, SPI INTERFACE
Manufacturer
Microchip Technology Inc.
Type
Programmable Peripheral Interfacer
Datasheet

Specifications of MCP23S08-E/SO

Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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MCP23008/MCP23S08
16-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS21919D-page 36
Note:
E
A
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
EXPOSED
NOTE 1
A3
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
PAD
1
2
0.80
0.00
2.50
2.50
0.25
0.30
0.20
MIN
MILLIMETERS
BOTTOM VIEW
N
0.65 BSC
0.20 REF
4.00 BSC
4.00 BSC
NOM
0.90
0.02
2.65
2.65
0.30
0.40
16
Microchip Technology Drawing C04-127B
D2
© 2007 Microchip Technology Inc.
MAX
1.00
0.05
2.80
2.80
0.35
0.50
L
K
b
e

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