MT47H64M16HW-37EL:E Micron Technology Inc, MT47H64M16HW-37EL:E Datasheet - Page 24
MT47H64M16HW-37EL:E
Manufacturer Part Number
MT47H64M16HW-37EL:E
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H64M16HW-37ELE.pdf
(135 pages)
Specifications of MT47H64M16HW-37EL:E
Organization
64Mx16
Density
1Gb
Address Bus
16b
Access Time (max)
500ps
Maximum Clock Rate
533MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
180mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
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Table 6: Temperature Limits
Figure 10: Example Temperature Test Point Location
PDF: 09005aef821ae8bf
Rev. O 9/08 EN
Parameter
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
Notes:
Test point
1. MAX storage case temperature T
2. MAX operating case temperature T
3. Device functionality is not guaranteed if the device exceeds maximum T
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
in Figure 10 (page 24). This case temperature limit is allowed to be exceeded briefly
during package reflow, as noted in Micron technical note TN-00-15, “Recommended Sol-
dering Parameters.”
in Figure 10 (page 24).
tion.
Lmm x Wmm FGBA
Width (W)
0.5 (W)
0.5 (L)
Length (L)
Electrical Specifications – Absolute Ratings
24
STG
Symbol
C
T
Micron Technology, Inc. reserves the right to change products or specifications without notice.
is measured in the center of the package, as shown
T
T
T
STG
is measured in the center of the package, as shown
A
C
C
1Gb: x4, x8, x16 DDR2 SDRAM
Min
–55
–40
–40
0
Max
150
85
95
85
© 2004 Micron Technology, Inc. All rights reserved.
Units
°C
°C
°C
°C
C
during opera-
Notes
2, 3, 4
2, 3
4, 5
1
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