PTN3332DH,112 NXP Semiconductors, PTN3332DH,112 Datasheet
PTN3332DH,112
Specifications of PTN3332DH,112
PTN3332DH
PTN3332DH
Related parts for PTN3332DH,112
PTN3332DH,112 Summary of contents
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PTN3332 High speed differential line receiver Rev. 02 — 14 August 2006 1. General description The PTN3332 is a differential line receiver that implements the electrical characteristics of Low-Voltage Differential Signaling (LVDS). This device meets or exceeds the requirements of ...
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Philips Semiconductors 4. Ordering information Table 1. Type number PTN3332DH PTN3332D 5. Functional diagram Fig 1. Functional diagram of PTN3332 PTN3332_2 Product data sheet Ordering information Package Name Description TSSOP16 plastic thin shrink small outline package; 16 leads; body width ...
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Philips Semiconductors 6. Pinning information 6.1 Pinning GND Fig 2. Pin configuration for TSSOP16 6.2 Pin description Table 2. Symbol GND ...
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Philips Semiconductors 7. Functional description Refer to 7.1 Function table Table HIGH level LOW level irrelevant; high-Z = high-impedance indeterminate state Differential input nA 100 mV ID 100 mV ...
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Philips Semiconductors 10. Static characteristics Table 6. Static characteristics Over recommended operating conditions, unless otherwise specified. Symbol Parameter V positive differential input voltage rr+ threshold V negative differential input voltage rr threshold V HIGH-level output voltage OH V LOW-level output ...
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Philips Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics Over recommended operating condition, unless otherwise specified. Symbol Parameter t LOW-to-HIGH propagation delay PLH t HIGH-to-LOW propagation delay PHL t rise time r t fall time f t pulse skew time ...
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Philips Semiconductors 12. Test information Fig 4. Voltage definitions Table 8. Applied voltages V IA 1.25 V 1.15 V 2.4 V 2 1.5 V 0.9 V 2.4 V 1 PTN3332_2 ...
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Philips Semiconductors Fig 5. Timing test circuit and waveforms PTN3332_2 Product data sheet High speed differential line receiver PHL PLH ...
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Philips Semiconductors Fig 6. Enable/disable time test circuit and waveforms PTN3332_2 Product data sheet TEST PLZ t PZL Y V TEST PHZ ...
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Philips Semiconductors 13. Package outline TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. ...
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Philips Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not ...
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Philips Semiconductors – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to ...
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Philips Semiconductors [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C body ...
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Philips Semiconductors 17. Legal information 17.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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Philips Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...